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HY27SS16121M-FPCB PDF预览

HY27SS16121M-FPCB

更新时间: 2024-09-25 19:36:15
品牌 Logo 应用领域
海力士 - HYNIX 内存集成电路
页数 文件大小 规格书
43页 729K
描述
Flash, 32MX16, 12000ns, PBGA63, 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63

HY27SS16121M-FPCB 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA,
针数:63Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.84最长访问时间:12000 ns
JESD-30 代码:R-PBGA-B63JESD-609代码:e1
长度:15 mm内存密度:536870912 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1端子数量:63
字数:33554432 words字数代码:32000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:32MX16
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL峰值回流温度(摄氏度):260
编程电压:1.8 V认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:20
宽度:8.5 mmBase Number Matches:1

HY27SS16121M-FPCB 数据手册

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HY27SS(08/16)121M Series  
HY27US(08/16)121M Series  
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash  
Document Title  
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash Memory  
Revision History  
No.  
0.0  
0.1  
0.2  
0.3  
History  
Draft Date  
Sep.17.2003  
Oct.07.2003  
Nov.08.2003  
Dec.01.2003  
Remark  
Preliminary  
Preliminary  
Preliminary  
Preliminary  
Initial Draft  
Renewal Product Group  
Make a decision of PKG information  
Append 1.8V Operation Product to Data sheet  
1) Add Errata  
tWC tWH tWP tRC tREH tRP tREA@ID Read  
Specification  
50  
60  
15  
20  
25  
40  
50  
60  
15  
20  
30  
40  
35  
45  
Relaxed value  
0.4  
Mar.28.2004  
Preliminary  
2) Modify the description of Device Operations  
- /CE Don’t Care Enabled(Disabled) -> Sequential Row Read Disabled  
(Enabled) (Page22)  
3) Add the description of System Interface Using CE don’t care  
(Page37)  
1) Delete Errata  
2) Change Characteristics (3V Product)  
tCRY  
tREA@ID Read  
0.5  
0.6  
Jun. 01. 2004  
Oct. 20. 2004  
Preliminary  
Before  
After  
60 + tr  
70 + tr  
35  
45  
3) Delete Cache Program  
1) Change TSOP1, WSOP1, FBGA package dimension  
2) Edit TSOP1, WSOP1 package figures  
3) Change FBGA package figure  
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for  
use of circuits described. No patent licenses are implied.  
Rev 0.6 / Oct. 2004  
1

与HY27SS16121M-FPCB相关器件

型号 品牌 获取价格 描述 数据表
HY27SS16121M-FPCP HYNIX

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Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB
HY27SS16121M-FPCS HYNIX

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Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB
HY27SS16121M-FPEB HYNIX

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暂无描述
HY27SS16121M-FPEP HYNIX

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Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB
HY27SS16121M-FPES HYNIX

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Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB
HY27SS16121M-FPI HYNIX

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暂无描述
HY27SS16121M-FPIB HYNIX

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Flash, 32MX16, 12000ns, PBGA63, 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB
HY27SS16121M-FPIP HYNIX

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Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB
HY27SS16121M-FPIS HYNIX

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Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB
HY27SS16561A HYNIX

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256Mbit (32Mx8bit / 16Mx16bit) NAND Flash