生命周期: | Active | 零件包装代码: | DFP |
包装说明: | DFP, FL32,.6 | 针数: | 32 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.1 |
最长访问时间: | 30 ns | 最大时钟频率 (fCLK): | 28 MHz |
周期时间: | 34 ns | JESD-30 代码: | R-CDFP-F32 |
长度: | 20.828 mm | 内存密度: | 36864 bit |
内存集成电路类型: | OTHER FIFO | 内存宽度: | 36 |
功能数量: | 1 | 端子数量: | 32 |
字数: | 1024 words | 字数代码: | 1000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 1KX36 |
可输出: | YES | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | DFP | 封装等效代码: | FL32,.6 |
封装形状: | RECTANGULAR | 封装形式: | FLATPACK |
并行/串行: | PARALLEL | 电源: | 5 V |
认证状态: | Not Qualified | 座面最大高度: | 3.81 mm |
最大待机电流: | 0.001 A | 子类别: | FIFOs |
最大压摆率: | 0.5 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | FLAT |
端子节距: | 1.27 mm | 端子位置: | DUAL |
宽度: | 15.24 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
HX6136TERC | HONEYWELL |
获取价格 |
FIFO, 1KX36, 30ns, Synchronous, CMOS, CDFP32, CERAMIC, DFP-32 | |
HX6136TERT | HONEYWELL |
获取价格 |
FIFO, 1KX36, 30ns, Synchronous, CMOS, CDFP32, CERAMIC, DFP-32 | |
HX6136TQFT | HONEYWELL |
获取价格 |
IC 1K X 36 OTHER FIFO, 30 ns, CDFP32, CERAMIC, QFP-32, FIFO | |
HX6136TQHC | HONEYWELL |
获取价格 |
IC 1K X 36 OTHER FIFO, 30 ns, CDFP32, CERAMIC, QFP-32, FIFO | |
HX6136TQNC | HONEYWELL |
获取价格 |
FIFO, 1KX36, 30ns, Synchronous, CMOS, CDFP32, CERAMIC, QFP-32 | |
HX6136TQNT | HONEYWELL |
获取价格 |
IC 1K X 36 OTHER FIFO, 30 ns, CDFP32, CERAMIC, QFP-32, FIFO | |
HX6136TSHC | HONEYWELL |
获取价格 |
FIFO, 1KX36, 30ns, Synchronous, CMOS, CDFP32, CERAMIC, QFP-32 | |
HX6136TSHT | HONEYWELL |
获取价格 |
FIFO, 1KX36, 30ns, Synchronous, CMOS, CDFP32, CERAMIC, QFP-32 | |
HX6136TSNC | HONEYWELL |
获取价格 |
FIFO, 1KX36, 30ns, Synchronous, CMOS, CDFP32, CERAMIC, QFP-32 | |
HX6136TVHC | HONEYWELL |
获取价格 |
IC 1K X 36 OTHER FIFO, 30 ns, CDFP32, CERAMIC, QFP-32, FIFO |