HX421C14FBK2/16
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR4-2133 CL14 288-Pin DIMM
SPECIFICATIONS
CL(IDD)
14 cycles
Row Cycle Time (tRCmin)
46.5ns(min.)
260ns(min.)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
32.75ns(min.)
TBD W*
94 V - 0
0o C to +85o C
-55o C to +100o C
Operating Temperature
Storage Temperature
*Power will vary depending on the SDRAM used.
DESCRIPTION
FEATURES
• Power Supply: VDD = 1.2V Typical
HyperX HX421C14FBK2/16 is a kit of two 1G x 64-bit (8GB)
DDR4-2133 CL14 SDRAM (Synchronous DRAM) 2Rx8, memory
module, based on sixteen 512M x 8-bit FBGA components per
module. Each module kit supports Intel® Extreme Memory
Profiles (Intel® XMP) 2.0. Total kit capacity is 16GB. Each
module has been tested to run at DDR4-2133 at a low latency
timing of 14-14-14 at 1.2V. Additional timing parameters are
shown in the Plug-N-Play (PnP) Timing Parameters section
below. The JEDEC standard electrical and mechanical
specifications are as follows:
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Dual-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
JEDEC/XMP TIMING PARAMETERS
• Terminated control command and address bus
• Height 1.340” (34.04mm), w/heatsink
• JEDEC/PnP:
DDR4-2133 CL14-14-14 @1.2V
• XMP Profile #1: DDR4-2133 CL14-14-14 @1.2V
Continued >>
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Document No. 4807240-001.B00 04/21/15 Page 1