Datasheet > HX426C13SBK4-32

HX426C13SBK4-32

更新时间： 2024-11-25 01:19:15

品牌	Logo	应用领域
其他 - ETC		双倍数据速率
页数	文件大小	规格书
2页	320K
描述
DDR4-2666 CL13 288-Pin DIMM Kit

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中文翻译

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数据手册

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HX426C13SBK4-32 数据手册

Memory Module Specifications

HX426C13SBK2/16

16GB (8GB 1G x 64-Bit x 2 pcs.)

DDR4-2666 CL13 288-Pin DIMM Kit

SPECIFICATIONS

CL(IDD)

15 cycles

Row Cycle Time (tRCmin)

45ns (min.)

260ns (min.)

Refresh to Active/Refresh

Command Time (tRFCmin)

Row Active Time (tRASmin)

Maximum Operating Power

UL Rating

33ns (min.)

TBD W*

94 V - 0

0^oC to +85^oC

-55^oC to +100^oC

Operating Temperature

Storage Temperature

*Power will vary depending on the SDRAM used.

DESCRIPTION

FEATURES

HyperX HX426C13SBK2/16 is a kit of two 1G x 64-bit (8GB)

DDR4-2666 CL13 SDRAM (Synchronous DRAM) 2Rx8, memory

modules, based on sixteen 512M x 8-bit FBGA components per

module. Total kit capacity is 16GB. Each module supports

Intel® XMP (Extreme Memory Profiles). Each module has

been tested to run at DDR4-2666 at a low latency timing of

13-14-14 at 1.35V. The SPDs are programmed to JEDEC

standard latency DDR4-2133 timing of 15-15-15 at 1.2V.

Each 288-pin DIMM uses gold contact fingers. The JEDEC

standard electrical and mechanical specifications are as

follows:

• Power Supply: VDD = 1.2V Typical

• VDDQ = 1.2V Typical

• VPP - 2.5V Typical

• VDDSPD = 2.25V to 3.6V

• On-Die termination (ODT)

• 16 internal banks; 4 groups of 4 banks each

• Bi-Directional Differential Data Strobe

• 8 bit pre-fetch

• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)

• Height 1.36” (34.57mm)

XMP TIMING PARAMETERS

•JEDEC: DDR4-2133 CL15-15-15 @1.2V

•XMP Profile #1: DDR4-2666 CL13-14-14 @1.35V

•XMP Profile #2: DDR4-2400 CL13-13-13 @1.35V

Continued >>

hyperxgaming.com

Document No. 4807412-001.A00 08/27/15 Page 1

中文翻译

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