HRF3205, HRF3205S
o
Absolute Maximum Ratings
T = 25 C, Unless Othewise Specified
C
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
55
55
V
V
V
DSS
DGR
Drain to Gate Voltage (R
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain Current
±20V
GS
Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
100
390
A
A
D
Pulsed Drain Current (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
DM
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
Figure 10
175
1.17
AS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
W
D
o
o
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
W/ C
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
J
-55 to 175
C
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
o
300
260
C
C
L
o
pkg
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
o
o
1. T = 25 C to 150 C.
J
o
Electrical Specifications
T = 25 C, Unless Otherwise Specified
C
PARAMETER
SYMBOL
BV
TEST CONDITIONS
= 0V
MIN
TYP
MAX
-
UNITS
V
Drain to Source Breakdown Voltage
Gate to Source Threshold Voltage
Zero Gate Voltage Drain Current
I
= 250µA, V
55
2
-
-
DSS
GS(TH)
D
GS
V
V
V
V
V
= V , I = 250µA
-
4
V
GS
DS
DS
GS
DS D
I
= 55V, V
= 44V, V
= ±20V
= 0V
-
25
250
100
-
µA
µA
nA
V
DSS
GS
o
= 0V, T = 150 C
-
-
-
GS
C
Gate to Source Leakage Current
I
-
GSS
o
Breakdown Voltage Temperature
Coefficient
∆V
/
Reference to 25 C, I = 250µA
-
0.057
(BR)DSS
∆T
D
J
Drain to Source On Resistance
Turn-On Delay Time
Rise Time
r
I
= 59A, V
= 10V (Figure 4)
= 28V, I 59A,
D
-
-
-
-
-
-
-
-
-
-
-
-
0.0065
14
0.008
Ω
DS(ON)
D GS
t
V
R
R
-
ns
ns
ns
ns
nC
nC
nC
pF
pF
pF
nH
d(ON)
DD
= 0.47Ω, V = 10V,
L
GS
t
100
43
-
r
= 2.5Ω
GS
Turn-Off Delay Time
Fall Time
t
-
d(OFF)
t
70
-
170
32
74
-
f
Total Gate Charge
Q
V
V
= 44V, I
= 10V, I
59A,
= 3mA
-
g
DD
GS
D
g(REF)
Gate to Source Charge
Gate to Drain “Miller” Charge
Input Capacitance
Q
Q
-
gs
(Figure 6)
-
gd
C
V
= 25V, V
= 0V,
4000
1300
480
7.5
ISS
DS GS
f = 1MHz (Figure 5)
Output Capacitance
Reverse Transfer Capacitance
Internal Source Inductance
C
C
-
OSS
-
RSS
L
Measured From the Contact
Modified MOSFET
-
S
Screw on Tab to Center of Die Symbol Showing the
Internal Devices In-
ductances
Measured From the Drain
Lead, 6mm (0.25in) From
Package to Center of Die
D
L
D
Internal Drain Inductance
L
Measured From the Source
Lead, 6mm (0.25in)From Head-
er to Source Bonding Pad
-
4.5
-
nH
D
G
L
S
S
o
Thermal Resistance Junction to Case
R
R
-
-
-
-
-
-
0.85
62
C/W
θJC
o
Thermal Resistance Junction to
Ambient
TO-220
C/W
θJA
o
TO-263 (PCB Mount, Steady State)
40
C/W
©2001 Fairchild Semiconductor Corporation
HRF3205, HRF3205S Rev. B