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HPND-0001 PDF预览

HPND-0001

更新时间: 2024-11-08 23:56:31
品牌 Logo 应用领域
其他 - ETC 二极管开关测试限制器衰减器
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2页 31K
描述
Chip PIN diodes for hybrid assemblies

HPND-0001 数据手册

 浏览型号HPND-0001的Datasheet PDF文件第2页 
Small Signal RF PIN Diode Chips  
for Hybrid Integrated Circuits  
Technical Data  
HPND-0001  
HPND-0002  
Features  
Description  
Outline 01B  
Chip Dimensions  
• Thermocompression/  
Thermosonically Bondable  
These PIN/NIP diode chips are  
specifically designed for hybrid  
applications requiring thermo-  
sonic or thermocompression  
bonding techniques. The top  
metallization is a layer of gold for  
a tarnish free surface that allows  
either thermosonic or  
• Ideal for Hybrid Integrated  
Circuits  
D
• Gold Metallization  
• Silicon Nitride Passivation  
X
• Uniform Electrical  
Characteristics  
thermocompression bonding  
techniques. The bottom metalli-  
zation is also gold, suitable for  
epoxy or eutectic die attach  
method.  
• Batch Matched Versions  
Available  
X
Y
• Planar Construction  
FOR EPOXY OR EUTECTIC  
DIE ATTACH  
Applications  
PART NO. HPND-  
DIMENSIONS  
These small signal, general  
purpose PIN/NIP diode chips are  
optimized for various analog and  
digital applications such as  
switches, digital phase shifters,  
pulse and amplitude modulators,  
limiters, leveling, and attenuating.  
-0001  
0.25  
(10)  
-0002  
0.20  
(8)  
D
(0.03) (1)  
X
0.51  
(20)  
0.38  
(15)  
(0.05) (2)  
Y
0.15  
(6)  
0.15  
(6)  
(0.03) (1)  
CATHODE  
ANODE  
CATHODE  
ANODE  
TOP CONTACT  
BOTTOM  
CONTACT  
DIMENSIONS IN MILLIMETERS (1/1000 INCH).  

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