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HN7G10FE-A PDF预览

HN7G10FE-A

更新时间: 2024-11-01 21:15:31
品牌 Logo 应用领域
东芝 - TOSHIBA 开关光电二极管晶体管
页数 文件大小 规格书
7页 287K
描述
TRANSISTOR 50 mA, 20 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, 2-2J1A, ES6, 6 PIN, FET General Purpose Small Signal

HN7G10FE-A 技术参数

生命周期:End Of Life包装说明:SMALL OUTLINE, R-PDSO-F6
针数:6Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.21.00.95
风险等级:5.7配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (ID):0.05 A
最大漏源导通电阻:12 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-F6元件数量:1
端子数量:6工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:YES端子形式:FLAT
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

HN7G10FE-A 数据手册

 浏览型号HN7G10FE-A的Datasheet PDF文件第2页浏览型号HN7G10FE-A的Datasheet PDF文件第3页浏览型号HN7G10FE-A的Datasheet PDF文件第4页浏览型号HN7G10FE-A的Datasheet PDF文件第5页浏览型号HN7G10FE-A的Datasheet PDF文件第6页浏览型号HN7G10FE-A的Datasheet PDF文件第7页 
HN7G10FE  
TOSHIBA Multichip Discrete Device  
HN7G10FE  
Power Management Switch Applications  
Unit: mm  
Driver Circuit Applications  
Interface Circuit Applications  
Q1 (transistor): 2SC5376F equivalent  
Q2 (MOSFET): SSM3K03FE equivalent  
Q1 (transistor) Absolute Maximum Ratings (Ta = 25°C)  
Characteristic  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
CBO  
V
CEO  
V
EBO  
15  
12  
5
V
V
1. EMITTER  
2. BASE  
3. DRAIN  
4. SOURCE  
5. GATE  
Collector-emitter voltage  
Emitter-base voltage  
Collector current  
V
I
400  
50  
mA  
mA  
C
6. COLLECTOR  
Base current  
I
B
JEDEC  
Q2 (MOSFET) Absolute Maximum Ratings (Ta = 25°C)  
JEITA  
Characteristic  
Drain-source voltage  
Symbol  
Rating  
Unit  
TOSHIBA  
2-2N1F  
V
20  
10  
50  
V
V
DS  
Weight: 3mg (typ.)  
Gate-source voltage  
Drain current  
V
GSS  
I
mA  
D
Absolute Maximum Ratings (Ta = 25°C) (Q1, Q2 Common)  
Characteristic  
Power dissipation  
Symbol  
Rating  
Unit  
P (Note 1)  
100  
150  
mW  
°C  
Junction temperature  
T
j
Storage temperature range  
T
stg  
55 to 150  
°C  
Note 1: Total rating  
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly  
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute  
maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2009-11-16  

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