Datasheet > HMC404

HMC404

更新时间： 2023-12-20 18:45:02

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
8页	356K
描述
GaAs MMIC次谐波IRM混频器芯片，26 - 33 GHz

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HMC404 数据手册

HMC404

v03.0907

GaAs MMIC SUB-HARMONICALLY

PUMPED IRM MIXER, 26 - 33 GHz

Absolute Maximum Ratings

RF / IF Input (Vdd = +5V)

LO Drive (Vdd = +5V)

Vdd

+13 dBm

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

+13 dBm

5.5V

Continuous Pdiss (Ta = 85 °C)

(derate 2.64 mW/°C above 85 °C)

238 mW

Storage Temperature

Operating Temperature

-65 to +150 °C

-55 to +85 °C

Outline Drawing

NOTES:

Die Packaging Information ^[1]

1. ALL DIMENSIONS IN INCHES (MILLIMETERS)

2. ALL TOLERANCES ARE 0.001 (0.025)

3. DIE THICKNESS IS 0.004 (0.100) BACKSIDE IS GROUND

4. BOND PADS ARE 0.004 (0.100) SQUARE

5. BOND PAD SPACING, CTR-CTR: 0.006 (0.150)

6. BACKSIDE METALLIZATION: GOLD

Standard

Alternate

GP-2

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

7. BOND PAD METALLIZATION: GOLD

8. NO CONNECTION REQUIRED TO UNLABED BOND PADS

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

For price, delivery, and to place orders: Analog Devices, Inc.,

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

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Application Support: Phone: 1-800-ANALOG-D

Trademarks and registered trademarks are the property of their respective owners.

Order On-line at www.hittite.com

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