HGL34A thru HGL34M
SSUURRFFAACCEEMOUNT GLASS
FEATURES
DO-213AA / MINI MELF
Ldeal for surface mounted applications
Low leakage current
Glass passivated chips
SOLDERABLE ENDS
High temperature soldering guaranteed
o
250 C/10 seconds/.375 , (9.5mm) lead lengths
0.066(1.676)
D1=
CATHODE BAND
0.060(1.524)
D2
MECHANICAL DATA
0.022(0.559)
0.016(0.406)
Case Molded plastic use UL94V-0 recoqnized
flame retardant epoxy
0.145(3.683)
+0
D2=D1
0.131(3.327)
Terminals Plated terminals, solderable per
MIL-STD-202, Method208
-0.008(0.20)
Polarity Color band on body denotes cathode
Mounting position Any
Dimension in inches (millimeters)
Weight 0.036gram
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
o
Ratings at 25 C ambient temp. unless otherwise specified
Single phase, half sine wave, 60Hz, resistive or inductive load
For capacitive load, derate current by 20%
HGL
34A
HGL
34B
HGL
34D
HGL
34G
HGL
34J
HGL
34K
HGL
34M
SYMBOL
UNITS
Volts
Maximum Current Peak Reverse Voltage
Maximum RMS Voltage
VRRM
50
35
50
100
70
200
140
200
400
280
400
0.5
600
420
600
800
560
800
1000
700
Volts
VRMS
Maximum DC Blocking Voltage
Volts
VDC
100
1000
0
Amps
I(AV)
Maximum Average Forward Rectified Current TT=55 C
Peak Forward Surge Current Single Sine-Wave on Rated
Load (JEDEC Method)
Amps
Volts
A
IFSM
VF
IR
10
Maximum Instantaneous Forward Voltage Drop at 1.0A DC
1.1
1.3
1.75
0
Maximum DC Reverse Current TA=25 C
5.0
0
at Rated DC Blocking Voltage TA=125 C
100
Maximum Reverse Recovery Time, Test Conditions IF=0.5A,
IR=1.0A , IRR=0.25A
nS
TRR
50
75
pF
Typical Junction Capacitance
CJ
17
15
TJ
0
Operating Junction and Storage Temperature Range
-55 to +150
C
TSTG
http://www.lgesemi.com
mail:lge@lgesemi.com
Revision:20170701-P1