Typical Characteristics (continued)
2.5
2.0
1.5
1.0
0.5
0.0
1.2
1.1
1.0
* Note :
1. VGS = 0 V
0.9
∗ Note :
1. VGS = 10 V
2. ID = 250 µA
2. ID = 25 A
0.8
-100
-100
-50
0
50
100
150
200
-50
0
50
100
150
200
TJ, Junction Temperature [oC]
TJ, Junction Temperature [oC]
Figure 8. On-Resistance Variation
vs Temperature
Figure 7. Breakdown Voltage Variation
vs Temperature
103
102
101
100
60
50
40
30
20
10
0
Operation in This Area
is Limited by R DS(on)
100 µs
1 ms
10 ms
DC
* Notes :
1. TC = 25 o
C
2. TJ = 175 o
C
3. Single Pulse
100
101
102
-1
10
25
50
75
100
125
150
175
TC, Case Temperature [oc]
VDS, Drain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs Case Temperature
100
D=0.5
* Notes :
0.2
0.1
1. ZθJC(t) = 1.24 oC/W Max.
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * ZθJC(t)
-1
10
0.05
PDM
0.02
0.01
single pulse
t1
t2
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
100
101
t1, Square Wave Pulse Duration [sec]
Figure 11. Transient Thermal Response Curve
◎ SEMIHOW REV.A0,Mar 2009