Datasheet > HFH6N90

HFH6N90

更新时间： 2024-11-11 05:35:59

品牌	Logo	应用领域
SEMIHOW		/
页数	文件大小	规格书
7页	932K
描述
900V N-Channel MOSFET

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数据手册

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HFH6N90 数据手册

Mar 2010

BV_DSS= 900 V

_{DS(on) typ}= 1.95 Ω

HFH6N90

900V N-Channel MOSFET

I_D= 6.0 A

TO-3P

FEATURES

 Originative New Design

 Superior Avalanche Rugged Technology

 Robust Gate Oxide Technology

 Very Low Intrinsic Capacitances

 Excellent Switching Characteristics

 Unrivalled Gate Charge : 35 nC (Typ.)

 Extended Safe Operating Area

 Lower R_DS(ON): 1.95 Ω (Typ.) @V_GS=10V

 100% Avalanche Tested

1.Gate 2. Drain 3. Source

Absolute Maximum Ratings

T_C=25℃ unless otherwise specified

Symbol

Parameter

Value

Units

V_DSS

Drain-Source Voltage

Drain Current

900

6.0

I_D

– Continuous (T_C= 25℃)

– Continuous (T_C= 100℃)

Drain Current

3.8

I_DM

V_GS

E_AS

I_AR

Drain Current

– Pulsed

(Note 1)

Gate-Source Voltage

±30

650

6.0

Single Pulsed Avalanche Energy

Avalanche Current

(Note 2)

(Note 1)

(Note 3)

E_AR

dv/dt

P_D

Repetitive Avalanche Energy

Peak Diode Recovery dv/dt

Power Dissipation (T_C= 25℃)

19.8

4.5

V/ns

198

1.59

W/℃

℃

- Derate above 25℃

Operating and Storage Temperature Range

T_J, T_STG

T_L

-55 to +150

Maximum lead temperature for soldering purposes,

1/8” from case for 5 seconds

300

℃

Thermal Resistance Characteristics

Symbol

Parameter

Typ.

Max.

Units

R_θJC

R_θCS

Junction-to-Case

Case-to-Sink

0.24

0.63

℃/W

Junction-to-Ambient

R_θJA

◎ SEMIHOW REV.A0,Mar 2010

12 3 4 5 6 7

中文翻译

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