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HF50D120ACE PDF预览

HF50D120ACE

更新时间: 2024-11-29 19:56:43
品牌 Logo 应用领域
英飞凌 - INFINEON 功效二极管
页数 文件大小 规格书
2页 58K
描述
Rectifier Diode, 1 Phase, 1 Element, 50A, Silicon, 125 MM, WAFER

HF50D120ACE 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:O-XUUC-NReach Compliance Code:compliant
HTS代码:8541.10.00.40风险等级:5.75
应用:EFFICIENCY配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
JESD-30 代码:O-XUUC-N元件数量:1
相数:1端子数量:1
最大输出电流:50 A封装主体材料:UNSPECIFIED
封装形状:ROUND封装形式:UNCASED CHIP
峰值回流温度(摄氏度):260认证状态:Not Qualified
表面贴装:YES端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:40
Base Number Matches:1

HF50D120ACE 数据手册

 浏览型号HF50D120ACE的Datasheet PDF文件第2页 
PD - 93877  
HF50D120ACE  
Hexfred Die in Wafer Form  
Features  
• GEN3 Hexfred Technology  
• Low VF  
• Low IRR  
• Low tRR  
1200V  
F(nom)=50A  
VF(typ)=1ꢀ78V@IF(nom) @ 25°C  
Motor Control Antiparallel Diode  
125mm Wafer  
I
• Soft Reverse Recovery  
Benefits  
• Benchmark Efficiency for Motor Control Applications  
• Rugged Transient Performance  
• Low EMI  
• Excellent Current Sharing in Parallel Operation  
Electrical Characteristics (Wafer Form)  
Parameter  
Description  
Guaranteed (min, max)  
TestConditions  
V
F
Forward Voltage Drop  
1'15V min, 1'47V max IC = 10A, TJ = 25°C  
BVR  
IRM  
Reverse Breakdown Voltage  
Reverse Leakage Current  
1200Vmin  
20µAmax  
TJ = 25°C, IR = 150µA  
TJ = 25°C, VR = 1200V  
Mechanical Data  
Nominal Backmetal Composition, (Thickness)  
Nominal Front Metal Composition, (Thickness)  
Dimensions  
Cr- Ni - Ag, (1kA - 4kA - 6kA)  
99%Al/1%Si, (3µm)  
0'257ꢀ x 0'257"  
Wafer Diameter  
125mm, with std' < 100 > flat  
310µm, +/-15µm  
Wafer Thickness, Tolerance  
Relevant Die Mechanical Dwg' Number  
Minimum Street Width  
01 - 5350  
100µm  
Reject Ink Dot Size  
0'25mm diameter minimum  
Consistent throughout same wafer lot  
Store in original container, in dessicated  
nitrogen, with no contamination  
For optimum electrical results, die attach  
temperature should not exceed 300°C  
Ink Dot Location  
Recommended Storage Environment  
Recommended Die Attach Conditions  
Die Outline  
NOT ES:  
6.53  
[.257]  
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].  
2. CONTROLLING DIMENSION: [INCH].  
3. DIMENSIONAL TOLERANCES:  
BONDING PADS: < 0.635 TOLERANCE  
=
+ /- 0.013  
< [.0250] TOLERANCE = + /- [.0005]  
> 0.635 TOLERANCE + /- 0.025  
5.21  
[.205]  
6.53  
[.257]  
ANODE  
WIDT H  
&
=
LENGTH  
> [.0250] TOLERANCE = + /- [.0010]  
OVERALL DIE:  
WIDT H  
< 1.270 TOLERANCE = + /- 0.102  
< [.050] TOLERANCE = + /- [.004]  
> 1.270 TOLERANCE = + /- 0.203  
> [.050] TOLERANCE = + /- [.008]  
5.21  
[.205]  
01-5350  
&
LENGTH  
wwwꢀirfꢀcom  
4/7/2000  
Page 1  

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