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Datasheet > HDAM-15-17.0-S-13-1
HDAM-15-17.0-S-13-1 PDF预览

HDAM-15-17.0-S-13-1

更新时间： 2024-11-12 19:28:15
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
2页 456K
描述
Board Stacking Connector, 195 Contact(s), 13 Row(s), Male, Straight, Surface Mount Terminal,

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HDAM-15-17.0-S-13-1 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：ActiveReach Compliance Code：compliant
Factory Lead Time：2 weeks风险等级：5.47
其他特性：HD MEZZ, HIGH DENSITY连接器类型：BOARD STACKING CONNECTOR
联系完成配合：GOLD (30) OVER NICKEL (50)联系完成终止：Matte Tin (Sn) - with Nickel (Ni) barrier
触点性别：MALE触点材料：COPPER ALLOY
DIN 符合性：NO滤波功能：NO
IEC 符合性：NOJESD-609代码：e3
MIL 符合性：NO插接信息：MULTIPLE MATING PARTS AVAILABLE
混合触点：NO安装方式：STRAIGHT
安装类型：BOARD装载的行数：13
选件：GENERAL PURPOSE端子节距：1.2 mm
端接类型：SURFACE MOUNT触点总数：195
Base Number Matches：1

HDAM-15-17.0-S-13-1 数据手册

 浏览型号HDAM-15-17.0-S-13-1的Datasheet PDF文件第2页 
DESIGNED & DIMENSIONED IN MILLIMETERS  
(INCHES FOR REFERENCE ONLY)  
HDAM-XX-XX.X-X-13-X-X  
REVISION D  
OPTION  
-P: PICK & PLACE PAD  
(USE MPP-26-01-N)  
No OF POSITIONS  
(13 ROW PER POSITION)  
"D" (REF)  
1.60 .063 (REF)  
DO NOT  
SCALE FROM  
THIS PRINT  
PIN 11A  
PIN 1A  
-11  
-15  
-23  
SOLDER CHARGE MATERIAL  
-1: 63%TIN / 37% LEAD  
-2: 95.5% TIN / 3.8% SILVER  
0.7% COPPER (LEAD FREE)  
3.25 .128 (REF)  
LEAD STYLE  
-12.0: 12MM  
-17.0: 17MM  
22.50 .886  
(REF)  
No OF ROWS  
C
L
-13  
PLATING SPECIFICATION  
-S: SELECTIVE, .000030 INCHES GOLD IN MATING AREA,  
MATTE TIN ON TAIL AND GUIDE PINS  
PIN 1M  
PIN 11M  
C
L
"E" (REF)  
C
C
L
L
"B"  
C
C
"A"  
WT-24-XX.X-T  
"F"  
2.00 .079  
(TYP) (REF)  
2.94 .116 (REF)  
HDAM-XX-XX.X  
(REF)  
"G"  
(REF)  
3.60 .142  
C
2.85 .112 (REF)  
C
"A"  
C
C
L
L
C
"B"  
1.25 .049  
(REF)  
D
"C" (REF)  
C
6.15 .242  
0.70 .028  
(SEE NOTE 5)  
C
SUB-IM-T-1M35-XX.X-S-X  
A
C
L
1.15 .045  
(REF)  
C
L
12 EQ. SPACES  
@1.2mm  
= 14.40[.567]  
C
13.00 .512  
(REF)  
(-12.0 SHOWN)  
C
L
(-17.0 SHOWN)  
CPC  
UNLESS OTHERWISE SPECIFIED,  
DIMENSIONS ARE IN  
MILLIMETERS [INCHES].  
PROPRIETARY NOTE  
1.65 .065  
(REF)  
FREQUENCY  
THIS SHEET  
A
THIS DOCUMENT CONTAINS INFORMATION  
CONFIDENTIAL AND PROPRIETARY TO  
SAMTEC, INC. AND SHALL NOT BE REPRODUCED  
OR TRANSFERRED TO OTHER DOCUMENTS OR  
DISCLOSED TO OTHERS OR USED FOR ANY  
PURPOSE OTHER THAN THAT WHICH IT WAS  
OBTAINED WITHOUT THE EXPRESSED WRITTEN  
CONSENT OF SAMTEC, INC.  
C1, C2, C3, TOLERANCES ARE:  
C4, C5, C6, DECIMALS  
C7, C8  
A
ANGLES  
2
SECTION A-A  
520 PARK EAST BLVD, NEW ALBANY, IN 47150  
.X: 0.3 [.01]  
1.20 .047  
(REF)  
PHONE: 812-944-6733  
FAX: 812-948-5047  
.XX: 0.13 [.005]  
e-Mail info@SAMTEC.com  
code 55322  
.XXX: 0.051 [.0020]  
B
MATERIAL:  
SHEET SCALE: 1.5:1  
DO NOT SCALE DRAWING  
DESCRIPTION:  
NOTES:  
INSULATOR: LCP, COLOR: BLACK  
CONTACT: COPPER ALLOY  
2.0MM PITCH HD ARRAY TERMINAL ASSEMBLY  
DWG. NO.  
FIG 1  
C
D
C
1.  
REPRESENTS A CRITICAL DIMENSION.  
-11: 11 POSITION  
WAFER MATERIAL: LCP, COLOR: BLACK  
GUIDE PIN MATERIAL: BRASS  
2. MINIMUM PUSHOUT FORCE: 2.22N[.5 LB]. FOR WAFERS  
(HDAM-11-12.0-X-13-X-X SHOWN)  
(SOME WAFERS NOT SHOWN FOR CLARITY)  
3. CONNECTORS TO BE PACKAGED IN TRAYS.  
HDAM-XX-XX.X-X-13-X-X  
PICK AND PLACE PAD: COPPER ALLOY  
4. USE THESE SURFACES TO MEASURE "G" DIMENSION.  
C
C
OF -A PIN.  
L
BY:  
D KNOWLDEN 7/15/2005 SHEET 1 OF 2  
5. DIMENSION FROM  
OF END TAIL TO  
L
F:\DWG\MISC\MKTG\HDAM-XX-XX.X-X-13-X-X-MKT.SLDDRW  
12

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