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Datasheet > HDAM-15-17.0-S-13-2
HDAM-15-17.0-S-13-2 PDF预览

HDAM-15-17.0-S-13-2

更新时间： 2024-11-12 19:21:51
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
1页 506K
描述
Board Stacking Connector, 195 Contact(s), 13 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT

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HDAM-15-17.0-S-13-2 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：ROHS COMPLIANT
Reach Compliance Code：compliantFactory Lead Time：2 weeks
风险等级：5.45其他特性：FINAL INCH, HD MEZZ
连接器类型：BOARD STACKING CONNECTOR联系完成配合：GOLD (30) OVER NICKEL (50)
联系完成终止：MATTE TIN OVER NICKEL (50)触点性别：MALE
触点材料：COPPER ALLOYDIN 符合性：NO
滤波功能：NOIEC 符合性：NO
JESD-609代码：e3MIL 符合性：NO
插接信息：MULTIPLE MATING PARTS AVAILABLE混合触点：NO
安装方式：STRAIGHT安装类型：BOARD
装载的行数：13选件：GENERAL PURPOSE
端子节距：2 mm端接类型：SURFACE MOUNT
触点总数：195Base Number Matches：1

HDAM-15-17.0-S-13-2 数据手册

  
HDAM–23–17.0–S–13–2  
F-219 SUPPLEMENT  
HDAM–11–12.0–S–13–2  
(2.00 mm) .0787"  
RUGGED ELEVATED HIGH-DENSITY ARRAY  
Open-pin-field for  
Single-Ended  
or Differential Pair  
configurations  
Mates with:  
HDAF  
Intermateable with  
Molex HD Mezz  
SPECIFICATIONS  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?HDAM  
Insulator Material:  
Black LCP  
Contact Material:  
Copper Alloy  
Plating:  
Lead-Free  
Solder Charge  
Au or Sn over  
50 µ" (1.27 µm) Ni  
Current Rating:  
3.4 A per pin  
• Integrated guide  
posts  
(6 adjacent pins powered)  
Operating Temp Range:  
-55 °C to +125 °C  
Working Voltage:  
200 VAC  
299, 195  
and 143 pins  
Mated Cycles:  
100  
RoHS Compliant:  
Yes  
Lead-Free Solderable:  
Yes  
Elevated stack heights  
of 20 mm, 25 mm,  
30 mm and 35 mm  
RECOGNITIONS  
For complete scope of  
recognitions see  
www.samtec.com/quality  
PLATING  
OPTION  
SOLDER  
TYPE  
OTHER  
OPTION  
NO. OF PINS  
PER ROW  
NO. OF  
ROWS  
LEAD  
STYLE  
HDAM  
FILE NO. E111594  
–S  
= 30 µ"  
(0.76 µm)  
Gold on  
contact area,  
Matte Tin  
on tails and  
guide pins  
–P  
= Pick &  
Place Pad  
Specify  
LEAD  
STYLE  
from  
–2  
= Lead-Free  
Tin Alloy  
95.5% Sn/  
3.8% Ag/  
0.7% Cu  
Solder  
DIFFERENTIAL  
APPLICATIONS  
–11, –15, –23  
–13  
(1.20)  
.0472  
chart  
Charge  
(2.00)  
.0787  
(22.50)  
.886  
(5.09)  
.200  
PAIR  
ARRAY  
COUNT*  
44  
60  
92  
11x13  
15x13  
23x13  
1A  
1M  
*2:1 S:G Ratio  
LEAD  
A
No. of  
No. of  
STYLE  
(2.00)  
.0787  
Pins  
Per  
Pins  
Per  
(14.41)  
.567  
(19.41)  
.764  
–12.0  
–17.0  
Row  
x
Row  
x
ALSO AVAILABLE  
(MOQ Required)  
(2.00)  
.0787  
+
(2.00)  
.0787  
+
• Tin-Lead Solder Charge  
• Other platings  
(16.06)  
.632  
(11.55)  
.455  
Notes:  
HD Mezz is a trademark of  
Molex Incorporated  
(1.20)  
.0472  
A
Note: Some lengths, styles  
and options are non-standard,  
non-returnable.  
Due to technical progress, all designs, specifications and components are subject to change without notice.  
WWW.SAMTEC.COM  
All parts within this catalog are built to Samtec’s specifications.  
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.  
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