Datasheet > HDAM-11-12.0-S-13-2

HDAM-11-12.0-S-13-2

更新时间： 2024-11-12 19:21:51

品牌	Logo	应用领域
申泰 - SAMTEC		/
页数	文件大小	规格书
1页	506K
描述
暂无描述

阅读下载

中文翻译

获取价格

数据手册
替代型号

如果您发现信息不准确，欢迎纠错

HDAM-11-12.0-S-13-2 数据手册

HDAM–23–17.0–S–13–2

F-219 SUPPLEMENT

HDAM–11–12.0–S–13–2

(2.00 mm) .0787"

HDAM SERIES

RUGGED ELEVATED HIGH-DENSITY ARRAY

Open-pin-ﬁeld for

Single-Ended

or Differential Pair

conﬁgurations

Mates with:

HDAF

Intermateable with

Molex HD Mezz

SPECIFICATIONS

For complete speciﬁcations and

recommended PCB layouts see

www.samtec.com?HDAM

Insulator Material:

Black LCP

Contact Material:

Copper Alloy

Plating:

Lead-Free

Solder Charge

Au or Sn over

50 µ" (1.27 µm) Ni

Current Rating:

3.4 A per pin

• Integrated guide

posts

(6 adjacent pins powered)

Operating Temp Range:

-55 °C to +125 °C

Working Voltage:

200 VAC

299, 195

and 143 pins

Mated Cycles:

100

RoHS Compliant:

Yes

Lead-Free Solderable:

Yes

Elevated stack heights

of 20 mm, 25 mm,

30 mm and 35 mm

RECOGNITIONS

For complete scope of

recognitions see

www.samtec.com/quality

PLATING

OPTION

SOLDER

TYPE

OTHER

OPTION

NO. OF PINS

PER ROW

NO. OF

ROWS

LEAD

STYLE

HDAM

FILE NO. E111594

–S

= 30 µ"

(0.76 µm)

Gold on

contact area,

Matte Tin

on tails and

guide pins

–P

= Pick &

Place Pad

Specify

LEAD

STYLE

from

–2

= Lead-Free

Tin Alloy

95.5% Sn/

3.8% Ag/

0.7% Cu

Solder

DIFFERENTIAL

APPLICATIONS

–11, –15, –23

–13

(1.20)

.0472

chart

Charge

(2.00)

.0787

(22.50)

.886

(5.09)

.200

PAIR

ARRAY

COUNT*

11x13

15x13

23x13

*2:1 S:G Ratio

LEAD

No. of

STYLE

(2.00)

.0787

Pins

Per

Pins

Per

(14.41)

.567

(19.41)

.764

–12.0

–17.0

Row

ALSO AVAILABLE

(MOQ Required)

(2.00)

.0787

(2.00)

.0787

• Tin-Lead Solder Charge

• Other platings

(16.06)

.632

(11.55)

.455

Notes:

HD Mezz is a trademark of

Molex Incorporated

(1.20)

.0472

Note: Some lengths, styles

and options are non-standard,

non-returnable.

Due to technical progress, all designs, speciﬁcations and components are subject to change without notice.

WWW.SAMTEC.COM

All parts within this catalog are built to Samtec’s speciﬁcations.

Customer speciﬁc requirements must be approved by Samtec and identiﬁed in a Samtec customer-speciﬁc drawing to apply.

中文翻译

下载PDF

HDAM-11-12.0-S-13-2 替代型号

型号	品牌	替代类型	描述	数据表
HDAM-11-12.0-S-13-1	SAMTEC	完全替代	Board Stacking Connector, 143 Contact(s), 13 Row(s), Male, Straight, Surface Mount Termina

与HDAM-11-12.0-S-13-2相关器件

型号	品牌	获取价格	描述	数据表
HDAM-11-17.0-S-13-1	SAMTEC	获取价格	Board Stacking Connector, 143 Contact(s), 13 Row(s), Male, Straight, Surface Mount Termina
HDAM-11-17.0-S-13-1-P	SAMTEC	获取价格	Board Stacking Connector
HDAM-11-17.0-S-13-2	SAMTEC	获取价格	Board Stacking Connector, 143 Contact(s), 13 Row(s), Male, Straight, Surface Mount Termina
HDAM-15-12.0-S-13-1	SAMTEC	获取价格	Board Stacking Connector, 195 Contact(s), 13 Row(s), Male, Straight, Surface Mount Termina
HDAM-15-12.0-S-13-1-P	SAMTEC	获取价格	Board Stacking Connector
HDAM-15-12.0-S-13-2	SAMTEC	获取价格	Board Stacking Connector, 195 Contact(s), 13 Row(s), Male, Straight, Surface Mount Termina
HDAM-15-17.0-S-13-1	SAMTEC	获取价格	Board Stacking Connector, 195 Contact(s), 13 Row(s), Male, Straight, Surface Mount Termina
HDAM-15-17.0-S-13-1-P	SAMTEC	获取价格	Board Stacking Connector
HDAM-15-17.0-S-13-2	SAMTEC	获取价格	Board Stacking Connector, 195 Contact(s), 13 Row(s), Male, Straight, Surface Mount Termina
HDAM-23-12.0-S-13-1	SAMTEC	获取价格	Board Stacking Connector, 299 Contact(s), 13 Row(s), Male, Straight, Surface Mount Termina

与HDAM-11-12.0-S-13-2相关文章

国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

23
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

8
AMD宣布全球裁员约1000人，调整战略聚焦增长
2024-11-14

9
英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

32

产品中心

服务支持

精选活动

关于我们

帮助中心

HDAM-11-12.0-S-13-2

HDAM-11-12.0-S-13-2 数据手册

HDAM-11-12.0-S-13-2 替代型号

与HDAM-11-12.0-S-13-2相关器件

与HDAM-11-12.0-S-13-2相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

HDAM-11-12.0-S-13-2

HDAM-11-12.0-S-13-2 数据手册

HDAM-11-12.0-S-13-2 替代型号

与HDAM-11-12.0-S-13-2相关器件

与HDAM-11-12.0-S-13-2相关文章

您还可以找

您在本页遇到什么问题？