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Datasheet > HDAF-11-08.0-S-13-1-P
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HDAF-11-08.0-S-13-1-P

更新时间： 2024-11-18 15:33:55
品牌 Logo 应用领域
申泰 - SAMTEC PC连接器
页数 文件大小 规格书
1页 686K
描述
Board Stacking Connector, 143 Contact(s), 13 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, Socket,

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HDAF-11-08.0-S-13-1-P 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：ActiveReach Compliance Code：compliant
Factory Lead Time：2 weeks 6 days风险等级：5.38
板上安装选件：PEG主体宽度：0.886 inch
主体深度：0.414 inch主体长度：1.572 inch
主体/外壳类型：SOCKET连接器类型：BOARD STACKING CONNECTOR
联系完成配合：GOLD (30) OVER NICKEL (50)联系完成终止：Matte Tin (Sn) - with Nickel (Ni) barrier
触点性别：FEMALE触点材料：COPPER ALLOY
触点模式：RECTANGULAR触点电阻：15 m Ω
DIN 符合性：NO介电耐压：700VAC V
耐用性：100 Cycles滤波功能：NO
IEC 符合性：NO绝缘电阻：5000000000 Ω
绝缘体颜色：BLACK绝缘体材料：LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码：e3MIL 符合性：NO
插接触点节距：0.079 inch插接信息：MULTIPLE MATING PARTS AVAILABLE
混合触点：NO安装选项1：LOCKING
安装方式：STRAIGHT安装类型：BOARD
连接器数：ONEPCB行数：13
装载的行数：13最高工作温度：125 °C
最低工作温度：-55 °C选件：GENERAL PURPOSE
PCB接触模式：RECTANGULARPCB触点行间距：1.1938 mm
电镀厚度：30u inch额定电流（信号）：1.8 A
参考标准：UL可靠性：COMMERCIAL
子类别：Headers and Edge Type Connectors端子节距：1.2 mm
端接类型：SURFACE MOUNT触点总数：143
Base Number Matches：1

HDAF-11-08.0-S-13-1-P 数据手册

  
F-219 SUPPLEMENT  
HDAF–23–08.0–S–13–2  
HDAF–15–18.0–S–13–2  
(2.00 mm) .0787"  
HDAF SERIES  
RUGGED ELEVATED HIGH-DENSITY ARRAY  
Mates with:  
HDAM  
Intermateable with  
Molex HD Mezz  
Open-pin-field for  
Single-Ended  
SPECIFICATIONS  
or Differential Pair  
configurations  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?HDAF  
Insulator Material:  
Black LCP  
Contact Material:  
Copper Alloy  
299,  
195  
and  
143  
pins  
Plating:  
Lead-Free  
Solder  
Charge  
Au or Sn over  
50 µ" (1.27 µm) Ni  
Current Rating:  
3.4 A per pin  
(6 adjacent pins powered)  
Operating Temp Range:  
-55 °C to +125 °C  
Working Voltage:  
200 VAC  
Elevated  
stack  
heights  
of 20 mm,  
25 mm,  
30 mm  
Mated Cycles:  
100  
RoHS Compliant:  
• Integrated guide  
posts  
Yes  
Lead-Free Solderable:  
Yes  
and 35 mm  
RECOGNITIONS  
For complete scope of  
recognitions see  
www.samtec.com/quality  
PLATING  
OPTION  
SOLDER  
TYPE  
OTHER  
OPTION  
NO. OF PINS  
PER ROW  
NO. OF  
ROWS  
LEAD  
STYLE  
HDAF  
FILE NO. E111594  
–S  
= 30 µ"  
(0.76 µm)  
Gold on  
contact area,  
Matte Tin  
on tails and  
guide pins  
–P  
= Pick &  
Place Pad  
Specify  
LEAD  
STYLE  
from  
–2  
= Lead-Free  
Tin Alloy  
95.5% Sn/  
3.8% Ag/  
0.7% Cu  
Solder  
DIFFERENTIAL  
APPLICATIONS  
–11, –15, –23  
–13  
(1.20)  
.0472  
chart  
Charge  
(2.00)  
.0787  
(22.50)  
.886  
PAIR  
ARRAY  
COUNT*  
44  
60  
92  
11x13  
15x13  
23x13  
No.  
of  
*2:1 S:G Ratio  
LEAD  
No.  
of  
A
Pins  
Per  
STYLE  
Pins  
Per  
(10.51)  
.414  
(20.51)  
.807  
Row  
x
–08.0  
–18.0  
Row  
x
ALSO AVAILABLE  
(2.00)  
.0787  
+
(MOQ Required)  
(2.00)  
.0787  
+
(11.55)  
.455  
• Tin-Lead Solder Charge  
• Other platings  
(17.92)  
.706  
1A  
1M  
(2.00)  
.0787  
(1.20)  
.0472  
Notes:  
HD Mezz is a trademark of  
Molex Incorporated  
A
Note: Some lengths, styles  
and options are non-standard,  
non-returnable.  
Due to technical progress, all designs, specifications and components are subject to change without notice.  
WWW.SAMTEC.COM  
All parts within this catalog are built to Samtec’s specifications.  
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.  
1

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