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Datasheet > HDAF11-18.0-S-13-2
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HDAF11-18.0-S-13-2

更新时间： 2024-11-18 20:40:19
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申泰 - SAMTEC PC连接器
页数 文件大小 规格书
1页 794K
描述
Board Stacking Connector, 143 Contact(s), 13 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT

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HDAF11-18.0-S-13-2 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：ROHS COMPLIANTReach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8536.69.40.40
风险等级：5.78其他特性：FINAL INCH, HD MEZZ
板上安装选件：PEG主体宽度：0.886 inch
主体深度：0.807 inch主体长度：1.572 inch
连接器类型：BOARD STACKING CONNECTOR联系完成配合：GOLD (30) OVER NICKEL (50)
联系完成终止：Matte Tin (Sn) - with Nickel (Ni) barrier触点性别：FEMALE
触点材料：COPPER ALLOY触点模式：RECTANGULAR
触点电阻：15 m ΩDIN 符合性：NO
介电耐压：700VAC V耐用性：100 Cycles
滤波功能：NOIEC 符合性：NO
绝缘电阻：5000000000 Ω绝缘体颜色：BLACK
绝缘体材料：LIQUID CRYSTAL POLYMER (LCP)JESD-609代码：e3
MIL 符合性：NO插接触点节距：0.079 inch
插接信息：MULTIPLE MATING PARTS AVAILABLE混合触点：NO
安装选项1：LOCKING安装方式：STRAIGHT
安装类型：BOARD连接器数：ONE
PCB行数：13装载的行数：13
最高工作温度：125 °C最低工作温度：-55 °C
选件：GENERAL PURPOSEPCB接触模式：RECTANGULAR
PCB触点行间距：1.1938 mm电镀厚度：30u inch
额定电流（信号）：1.8 A参考标准：UL
可靠性：COMMERCIAL子类别：Headers and Edge Type Connectors
端子节距：2 mm端接类型：SURFACE MOUNT
触点总数：143Base Number Matches：1

HDAF11-18.0-S-13-2 数据手册

  
F-211  
MEZZ  
(2,00mm) .0787"  
HDAM, HDAF SERIES  
HDAM–11–12.0–S–13–2  
HDAF–11–08.0–S–13–2  
RUGGED ELEVATED HIGH DENSITY ARRAY  
HDAM Mates with:  
PLATING  
OPTION  
SOLDER  
TYPE  
OTHER  
OPTION  
NO. OF PINS  
PER ROW  
NO. OF  
ROWS  
LEAD  
STYLE  
HDAF  
HDAM  
HDAF Mates with:  
HDAM  
SPECIFICATIONS  
–S  
= 30µ"  
(0,76µm)  
Gold on  
contact area,  
Matte Tin  
on tails and  
guide pins  
–P  
= Pick &  
Place Pad  
Specify  
LEAD  
STYLE  
from  
–2  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?HDAM or  
www.samtec.com?HDAF  
–11, –15, –23  
–13  
= Lead-Free  
Tin Alloy  
95.5% Sn/  
3.8% Ag/0.7% Cu  
Solder Charge  
Insulator Material:  
Black LCP  
Contact Material:  
Copper Alloy  
Current Rating:  
2.3A @ 80°C ambient  
Operating Temp Range:  
-55°C to +125°C  
Plating:  
chart  
(22,50)  
.886  
A
(2,00)  
.0787  
Au or Sn over  
50µ" (1,27µm) Ni  
Contact Resistance:  
19 mΩ max  
LEAD  
STYLE  
1A  
1M  
A
No. of  
Pins  
Per  
Row  
x
(2,00)  
.0787  
+
(11,55)  
.455  
No. of  
Pins  
Per  
(14,41)  
.567  
–12.0  
–17.0  
• Integrated guide  
Row  
x
Working Voltage:  
200 VAC  
(19,41)  
.764  
posts  
®
(2,00)  
.0787  
+
(16,06)  
.632  
Mated Cycles:  
100  
RoHS Compliant:  
Ye s  
Rated @ 3dB  
Lead-Free Solderable:  
Ye s  
35mm Stack Height  
Insertion Loss*  
Single-Ended Signaling  
Differential Pair Signaling  
9.0 GHz / 18.0 Gbps  
9.0 GHz / 18.0 Gbps  
(1,20)  
.0472  
(5,09)  
.200  
*Data based on simulations using Final Inch® design.  
DIFFERENTIAL  
APPLICATIONS  
Performance data for other stack heights and complete  
test data available at www.samtec.com?HDAM,  
www.samtec.com?HDAF or contact sig@samtec.com  
(1,20)  
.0472  
PLATING  
OPTION  
SOLDER  
TYPE  
OTHER  
OPTION  
NO. OF PINS  
PER ROW  
NO. OF  
ROWS  
LEAD  
STYLE  
HDAF  
(2,00)  
.0787  
PAIR  
ARRAY  
COUNT*  
–S  
= 30µ"  
(0,76µm)  
Gold on  
contact area,  
Matte Tin  
on tails and  
weld tabs  
–P  
44  
60  
92  
11x13  
15x13  
23x13  
= Pick &  
Place Pad  
Specify  
LEAD  
STYLE  
from  
–2  
= Lead-Free  
Tin Alloy  
95.5% Sn/  
3.8% Ag/  
0.7% Cu  
Solder Charge  
–11, –15, –23  
–13  
(22,50) .886  
*2:1 S:G Ratio  
chart  
No.  
of  
ALSO AVAILABLE  
Tin-Lead Solder Charge.  
Call Samtec.  
Pins  
Per  
No.  
of  
Pins  
Per  
Row  
x
(2,00)  
.0787  
+
(17,92)  
.706  
Row  
x
(2,00)  
.0787  
+
Note: Other Gold plating  
options available.  
Contact Samtec.  
(11,55)  
.455  
LEAD  
STYLE  
A
1M  
1A  
(10,51)  
.414  
(20,51)  
.807  
–08.0  
Note: HD Mezz is a trademark  
of Molex Incorporated  
• Integrated guide  
posts  
–18.0  
(1,20)  
.0472  
Note: Some lengths, styles  
and options are non-standard,  
non-returnable.  
(2,00)  
.0787  
A
WWW.SAMTEC.COM  
1

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