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Datasheet > HDAF-11-08.0-S-13-2
HDAF-11-08.0-S-13-2 PDF预览

HDAF-11-08.0-S-13-2

更新时间： 2024-11-18 20:55:43
品牌 Logo 应用领域
申泰 - SAMTEC PC连接器
页数 文件大小 规格书
2页 328K
描述
Board Stacking Connector, 143 Contact(s), 13 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT

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HDAF-11-08.0-S-13-2 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：ROHS COMPLIANT
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8536.69.40.40Factory Lead Time：3 weeks
风险等级：5.71其他特性：FINAL INCH, HD MEZZ
板上安装选件：PEG主体宽度：0.886 inch
主体深度：0.414 inch主体长度：1.572 inch
连接器类型：BOARD STACKING CONNECTOR联系完成配合：GOLD (30) OVER NICKEL (50)
联系完成终止：Matte Tin (Sn) - with Nickel (Ni) barrier触点性别：FEMALE
触点材料：COPPER ALLOY触点模式：RECTANGULAR
触点电阻：15 m ΩDIN 符合性：NO
介电耐压：700VAC V耐用性：100 Cycles
滤波功能：NOIEC 符合性：NO
绝缘电阻：5000000000 Ω绝缘体颜色：BLACK
绝缘体材料：LIQUID CRYSTAL POLYMER (LCP)JESD-609代码：e3
MIL 符合性：NO插接触点节距：0.079 inch
插接信息：MULTIPLE MATING PARTS AVAILABLE混合触点：NO
安装选项1：LOCKING安装方式：STRAIGHT
安装类型：BOARD连接器数：ONE
PCB行数：13装载的行数：13
最高工作温度：125 °C最低工作温度：-55 °C
选件：GENERAL PURPOSEPCB接触模式：RECTANGULAR
PCB触点行间距：1.1938 mm电镀厚度：30u inch
额定电流（信号）：1.8 A参考标准：UL
可靠性：COMMERCIAL子类别：Headers and Edge Type Connectors
端子节距：2 mm端接类型：SURFACE MOUNT
触点总数：143Base Number Matches：1

HDAF-11-08.0-S-13-2 数据手册

 浏览型号HDAF-11-08.0-S-13-2的Datasheet PDF文件第2页 
REVISION B  
HDAF-XX-XX.X-X-13-X-X  
"E" (REF)  
OPTION  
-P: PICK & PLACE PAD  
(USE MPP-26-01-N)  
1.60 .063 (REF)  
3.25 .128 (REF)  
No OF POSITIONS  
DO NOT  
SCALE FROM  
THIS PRINT  
(13 ROWS PER POSITION)  
PIN 1A  
PIN 11A  
-11  
-15  
-23  
B
C
SOLDER CHARGE MATERIAL  
-1: 63% TIN / 37% LEAD  
LEAD STYLE  
-08.0: 8MM  
-18.0: 18MM  
-2: 95.5% TIN / 3.8% SILVER  
0.7% COPPER (LEAD FREE)  
No OF ROWS  
-13  
22.50 .886 (REF)  
PLATING SPECIFICATION  
-S: SELECTIVE, .000030 INCHES GOLD IN MATING AREA,  
MATTE TIN ON TAIL AND WELD TABS  
PIN 1M  
PIN 11M  
"C" (REF)  
"F"(REF)  
"A"  
C
2.00 .079  
(TYP) (REF)  
HDAF-XX-XX.X  
2.85 .112  
(REF)  
"G"  
(REF)  
C
3.60 .142  
(2 PLCS)  
C
L
C
C
6.15 .242  
"A"  
C
C
L
L
C
WT-23-XX.X-T  
L
"B" C  
C
C
L
L
(-18.0 SHOWN)  
"D" (REF)  
C
0.70 .028  
SUB-IM-C-207-XX.X-S-X  
(SEE NOTE 4)  
"A"  
C 2.30 .091  
1.15 .045  
(REF)  
C
L
C
12 EQ. SPACES  
@ 1.2mm =  
14.40 [.567]  
13.00 .512  
(REF)  
C
L
C
L
C
L
C
L
0.70 .028  
(REF)  
(-08.0 SHOWN)  
1.65 .065 (REF)  
"A"  
SECTION "A"-"A"  
1.20 .047 (REF)  
UNLESS OTHERWISE SPECIFIED,  
DIMENSIONS ARE IN  
MILLIMETERS [INCHES].  
TOLERANCES ARE:  
PROPRIETARY NOTE  
FIG 1  
THIS DOCUMENT CONTAINS INFORMATION  
CONFIDENTIAL AND PROPRIETARY TO  
-11: 11 POSITION  
SAMTEC, INC. AND SHALL NOT BE REPRODUCED  
OR TRANSFERRED TO OTHER DOCUMENTS OR  
DISCLOSED TO OTHERS OR USED FOR ANY  
PURPOSE OTHER THAN THAT WHICH IT WAS  
OBTAINED WITHOUT THE EXPRESSED WRITTEN  
CONSENT OF SAMTEC, INC.  
(HDAF-11-08.0-X-13-X-X SHOWN)  
(SOME WAFERS NOT SHOWN FOR CLARITY)  
DECIMALS  
ANGLES  
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150  
.X: 0.3 [.01]  
PHONE: 812-944-6733  
FAX: 812-948-5047  
code: 55322  
.XX: 0.13 [.005]  
NOTES:  
e-Mail: info@SAMTEC.com  
.XXX: 0.051 [.0020]  
MATERIAL:  
SHEET SCALE: 1.5:1  
DESIGNED & DIMENSIONED  
IN MILLIMETERS  
(INCHES FOR REFERENCE ONLY)  
DO NOT SCALE DRAWING  
DESCRIPTION:  
C
1.  
REPRESENTS A CRITICAL DIMENSION.  
INSULATOR: LCP COLOR: BLACK  
CONTACT: COPPER ALLOY  
WAFER MATERIAL: LCP, COLOR: BLACK  
PICK AND PLACE PAD: COPPER ALLOY  
WELD TAB: BRASS  
2. MINIMUM PUSHOUT FORCE: 2.22N[.5 LB]. FOR  
WAFERS AND WELD TABS.  
2.0MM PITCH HD ARRAY SOCKET ASSEMBLY  
DWG. NO.  
3. CONNECTORS TO BE PACKAGED IN TRAYS.  
C
C
OF -A PIN.  
L
4. DIMENSION FROM  
OF END TAIL TO  
L
HDAF-XX-XX.X-X-13-X-X  
D KNOWLDEN  
SHEET 1 OF 2  
BY:  
7/14/2005  
F:\DWG\MISC\MKTG\HDAF-XX-XX.X-X-13-X-X-MKT.SLDDRW  
12

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HDAF-11-08.0-S-13-2 替代型号

型号 品牌 替代类型 描述 数据表
HDAF-11-08.0-S-13-1 SAMTEC

完全替代

 Board Stacking Connector, 143 Contact(s), 13 Row(s), Female, Straight, 0.079 inch Pitch, S

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