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Datasheet > HDAF-11-08.0-S-13-2-TR
HDAF-11-08.0-S-13-2-TR PDF预览

HDAF-11-08.0-S-13-2-TR

更新时间： 2024-09-23 18:14:31
品牌 Logo 应用领域
申泰 - SAMTEC PC连接器
页数 文件大小 规格书
3页 495K
描述
Board Connector, 143 Contact(s), 13 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Locking, Black Insulator

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HDAF-11-08.0-S-13-2-TR 技术参数

生命周期：ActiveReach Compliance Code：compliant
风险等级：5.76板上安装选件：PEG
主体宽度：0.886 inch主体长度：1.572 inch
连接器类型：BOARD CONNECTOR联系完成配合：AU ON NI
联系完成终止：TIN OVER NICKEL触点性别：FEMALE
触点材料：COPPER ALLOY触点模式：RECTANGULAR
触点电阻：19 m Ω耐用性：100 Cycles
绝缘体颜色：BLACK绝缘体材料：LIQUID CRYSTAL POLYMER (LCP)
插接触点节距：0.079 inch安装选项1：LOCKING
安装方式：STRAIGHT安装类型：BOARD
连接器数：ONEPCB行数：13
装载的行数：13最高工作温度：125 °C
最低工作温度：-55 °CPCB接触模式：RECTANGULAR
PCB触点行间距：1.1938 mm电镀厚度：30u inch
额定电流（信号）：3.4 A可靠性：COMMERCIAL
子类别：Headers and Edge Type Connectors端子节距：2.0066 mm
端接类型：SURFACE MOUNT触点总数：143
Base Number Matches：1

HDAF-11-08.0-S-13-2-TR 数据手册

 浏览型号HDAF-11-08.0-S-13-2-TR的Datasheet PDF文件第2页浏览型号HDAF-11-08.0-S-13-2-TR的Datasheet PDF文件第3页 
REVISION D  
HDAF-XX-XX.X-X-13-X-XX  
"E" (REF)  
OPTION  
1.60 .063 (REF)  
3.25 .128 (REF)  
No OF POSITIONS  
-P: PICK & PLACE PAD  
DO NOT  
SCALE FROM  
THIS PRINT  
(13 ROWS PER POSITION)  
PIN 1A  
PIN 11A  
(USE MPP-26-01-N)  
-11  
-15  
-23  
-TR: TAPE & REEL  
(ONLY TOOLED FOR HDAF-23-08.0-X-13-X-X)  
LEAD STYLE  
-08.0: 8MM  
-18.0: 18MM  
SOLDER CHARGE MATERIAL  
C
-1: 63% TIN / 37% LEAD  
22.50 .886 (REF)  
-2: 95.5% TIN / 3.8% SILVER  
0.7% COPPER (LEAD FREE)  
PLATING SPECIFICATION  
-S: 30µ'' GOLD IN MATING AREA,  
No OF ROWS  
-13  
MATTE TIN ON TAIL AND WELD TABS  
PIN 1M  
PIN 11M  
"C" (REF)  
"F"(REF)  
"A"  
C
2.00 .079  
(TYP) (REF)  
HDAF-XX-XX.X  
2.85 .112  
(REF)  
"G"  
(REF)  
3.60 .142  
(2 PLCS)  
C
C
L
C
C
6.15 .242  
"A"  
C
C
L
L
C
WT-23-XX.X-T  
L
"B" C  
C
C
L
L
(-18.0 SHOWN)  
"D" (REF)  
C
13.70 .539  
(SEE NOTE 4)  
SUB-IM-C-207-XX.X-S-X  
"A"  
C
2.30 .091  
1.15 .045  
(REF)  
C
L
C
12 EQ. SPACES  
@ 1.2mm =  
14.40 [.567]  
13.00 .512  
(REF)  
C
L
C
L
C
L
C
L
0.70 .028  
(REF)  
(-08.0 SHOWN)  
1.65 .065 (REF)  
"A"  
DESIGNED & DIMENSIONED  
IN MILLIMETERS  
SECTION "A"-"A"  
1.20 .047 (REF)  
UNLESS OTHERWISE SPECIFIED,  
DIMENSIONS ARE IN  
PROPRIETARY NOTE  
(INCHES FOR REFERENCE ONLY)  
FIG 1  
THIS DOCUMENT CONTAINS INFORMATION  
CONFIDENTIAL AND PROPRIETARY TO  
-11: 11 POSITION  
MILLIMETERS [INCHES].  
TOLERANCES ARE:  
SAMTEC, INC. AND SHALL NOT BE REPRODUCED  
OR TRANSFERRED TO OTHER DOCUMENTS OR  
DISCLOSED TO OTHERS OR USED FOR ANY  
PURPOSE OTHER THAN THAT WHICH IT WAS  
OBTAINED WITHOUT THE EXPRESSED WRITTEN  
CONSENT OF SAMTEC, INC.  
(HDAF-11-08.0-X-13-X-X SHOWN)  
(SOME WAFERS NOT SHOWN FOR CLARITY)  
DECIMALS  
ANGLES  
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150  
.X: 0.3 [.01]  
PHONE: 812-944-6733  
FAX: 812-948-5047  
code: 55322  
.XX: 0.13 [.005]  
e-Mail: info@SAMTEC.com  
.XXX: 0.051 [.0020]  
NOTES:  
MATERIAL:  
SHEET SCALE: 1.5:1  
DO NOT SCALE DRAWING  
DESCRIPTION:  
INSULATOR: LCP COLOR: BLACK  
CONTACT: COPPER ALLOY  
C
1.  
REPRESENTS A CRITICAL DIMENSION.  
2.0MM PITCH HD ARRAY SOCKET ASSEMBLY  
DWG. NO.  
WAFER MATERIAL: LCP, COLOR: BLACK  
PICK AND PLACE PAD: COPPER ALLOY  
WELD TAB: BRASS  
2. MINIMUM PUSHOUT FORCE: 2.22N[.5 LB]. FOR WAFERS AND WELD TABS.  
3. CONNECTORS TO BE PACKAGED IN TRAYS IF -TR OPTION IS NOT SELECTED,  
-TR OPTION IS ONLY TOOLED FOR HDAF-23-08.0-X-13-X-X.  
HDAF-XX-XX.X-X-13-X-XX  
C
C
OF -A PIN.  
L
4. DIMENSION FROM  
OF END TAIL TO  
SHEET 1 OF 3  
D KNOWLDEN  
7/14/2005  
BY:  
L
F:\DWG\MISC\MKTG\HDAF-XX-XX.X-X-13-X-XX-MKT.SLDDRW  
123

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