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HCS00MS PDF预览

HCS00MS

更新时间: 2023-12-20 18:46:25
品牌 Logo 应用领域
瑞萨 - RENESAS
页数 文件大小 规格书
8页 358K
描述
Quad 2-Input NAND Gate

HCS00MS 数据手册

 浏览型号HCS00MS的Datasheet PDF文件第2页浏览型号HCS00MS的Datasheet PDF文件第3页浏览型号HCS00MS的Datasheet PDF文件第4页浏览型号HCS00MS的Datasheet PDF文件第5页浏览型号HCS00MS的Datasheet PDF文件第6页浏览型号HCS00MS的Datasheet PDF文件第7页 
HCS00MS  
GLASSIVATION:  
Type: SiO2  
Thickness: 13kÅ 2.6kÅ  
Die Characteristics  
DIE DIMENSIONS:  
87 x 88 mils  
2.20mm x 2.24mm  
WORST CASE CURRENT DENSITY:  
<2.0 x 105A/cm2  
METALLIZATION:  
Type: AlSi  
Metal Thickness: 11kÅ 1kÅ  
BOND PAD SIZE:  
100m x 100m  
4 x 4 mils  
Metallization Mask Layout  
HCS00MS  
B1 (2)  
(12) A4  
(11) Y4  
Y1 (3)  
(10) B3  
A2 (4)  
B2 (5)  
(9) A3  
FN2138 Rev 2.00  
August 1995  
Page 8 of 8  

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