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HCPL-3180 PDF预览

HCPL-3180

更新时间: 2024-09-19 00:01:35
品牌 Logo 应用领域
安捷伦 - AGILENT 光电双极性晶体管驱动
页数 文件大小 规格书
19页 462K
描述
Current, High Speed IGBT/MOSFET Gate Drive Optocoupler

HCPL-3180 数据手册

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Agilent HCPL-3180 2 Amp Output  
Current, High Speed IGBT/MOSFET Gate  
Drive Optocoupler  
Data Sheet  
Features  
2 A minimum peak output current  
250 KHz maximum switching  
speed  
Description  
High speed response: 200 ns max  
This family of devices consists of  
a GaAsP LED. The LED is  
optically coupled to an  
integrated circuit with a power  
stage. These optocouplers are  
ideally suited for high frequency  
driving of power IGBT and  
MOSFETs used in Plasma  
Display Panels, high  
Propagation delay over  
temperature range  
VCC  
VO  
N/C  
1
2
3
4
8
7
6
5
ANODE  
10 KV/us minimum common mode  
rejection (CMR) at V =1500 V  
CM  
CATHODE  
Under voltage lockout protection  
VO  
(UVLO) with hysteresis  
VEE Wide operating temperature  
N/C  
°
range: -40 °C to +100 C  
Wide V operating range:  
CC  
performance DC/DC convertors  
and motor control invertor  
applications.  
Functional Diagram  
10 V to 20 V  
20 ns typ pulse width distortion  
Safety Approvals:  
UL approval pending  
Ordering Information  
Specify part number followed by  
option number (if desired):  
3750 V  
CSA approval  
for 1 minute.  
RMS  
DIN EN 60747-5-2 approval  
pending  
Example : HCPL-3180-XXX  
No option = Standard DIP  
package, 50 per tube.  
Applications  
300 = Gull Wing Surface Mount  
Option, 50 per tube.  
Plasma Display Panel (PDP)  
Distributed power architecture  
(DPA)  
Switch mode rectifier (SMR)  
High performance DC/DC  
convertor  
High performance switch mode  
power supply (SMPS)  
High performance uninterruptible  
power supply (UPS)  
500 = Tape and Reel Packaging  
Option.  
060 = DIN EN 60747-5-2 Option,  
VIORM=630 Vpeak (pending  
approval)  
Isolated IGBT/Power MOSFET  
gate drive  
A 0.1 uF bypass capacitor must be connected between pins 5 and 8.  
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/  
or degradation which may be induced by ESD.  

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