是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | DIP | 包装说明: | PLASTIC, DIP-22 |
针数: | 22 | Reach Compliance Code: | not_compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.77 |
电池馈电: | CONSTANT CURRENT/RESISTIVE | 电池供电: | -24 TO -58 V |
混合: | 2-4 CONVERSION | JESD-30 代码: | R-PDIP-T22 |
JESD-609代码: | e0 | 负电源额定电压: | -5 V |
功能数量: | 1 | 端子数量: | 22 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | DIP |
封装等效代码: | DIP22,.4 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | +-5 V | 认证状态: | Not Qualified |
子类别: | Analog Transmission Interfaces | 最大压摆率: | 9.5 mA |
标称供电电压: | 5 V | 表面贴装: | NO |
技术: | BIPOLAR | 电信集成电路类型: | SLIC |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
HC5515CP | INTERSIL |
获取价格 |
ITU CO/PABX SLIC with Low Power Standby |
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HC5515ICM | RENESAS |
获取价格 |
TELECOM-SLIC, PQCC28, PLASTIC, LCC-28 |
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HC5515IM | INTERSIL |
获取价格 |
ITU CO/PABX SLIC with Low Power Standby |
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HC5515IM96 | RENESAS |
获取价格 |
TELECOM-SLIC, PQCC28 |
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HC5515IP | INTERSIL |
获取价格 |
ITU CO/PABX SLIC with Low Power Standby |
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HC5517 | INTERSIL |
获取价格 |
3 REN Ringing SLIC For ISDN Modem/TA and WLL |
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HC5517_00 | INTERSIL |
获取价格 |
3 REN Ringing SLIC For ISDN Modem/TA and WLL |
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HC55171 | INTERSIL |
获取价格 |
5 REN Ringing SLIC for ISDN Modem/TA and WLL |
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HC55171_03 | INTERSIL |
获取价格 |
5 REN Ringing SLIC for ISDN Modem/TA and WLL |
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HC55171B | INTERSIL |
获取价格 |
Low Cost 5 REN Ringing SLIC for ISDN Modem/TA and WL |
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