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HC5517BCM

更新时间： 2024-01-15 18:53:09
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英特矽尔 - INTERSIL 调制解调器综合业务数字网
页数 文件大小 规格书
11页 91K
描述
Low Cost 3 REN Ringing SLIC for ISDN Modem/TA and WL

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中文翻译

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HC5517BCM 技术参数

是否Rohs认证：不符合生命周期：Obsolete
Reach Compliance Code：unknownHTS代码：8542.39.00.01
风险等级：5.67Is Samacsys：N
电池馈电：RESISTIVE电池供电：-24 V
混合：2-4 CONVERSIONJESD-30 代码：S-PQCC-J28
JESD-609代码：e0功能数量：1
端子数量：28最高工作温度：85 °C
最低工作温度：-40 °CPSRR-Min：20 dB
封装主体材料：PLASTIC/EPOXY封装代码：QCCJ
封装等效代码：LDCC28,.5SQ封装形状：SQUARE
封装形式：CHIP CARRIER峰值回流温度（摄氏度）：NOT SPECIFIED
电源：5 V认证状态：Not Qualified
子类别：Analog Transmission Interfaces最大压摆率：6 mA
标称供电电压：5 V表面贴装：YES
技术：BIPOLAR电信集成电路类型：SLIC
温度等级：INDUSTRIAL端子面层：Tin/Lead (Sn/Pb)
端子形式：J BEND端子节距：1.27 mm
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

HC5517BCM 数据手册

 浏览型号HC5517BCM的Datasheet PDF文件第2页浏览型号HC5517BCM的Datasheet PDF文件第3页浏览型号HC5517BCM的Datasheet PDF文件第4页浏览型号HC5517BCM的Datasheet PDF文件第5页浏览型号HC5517BCM的Datasheet PDF文件第6页浏览型号HC5517BCM的Datasheet PDF文件第7页 
HC5517B  
Data Sheet  
July 1998  
File Number 4404.2  
Low Cost 3 REN Ringing SLIC for ISDN  
Modem/TA and WL  
Features  
• Load Drive Capability . . . . . . . . . . . . . . . . . . . . . . . 3REN  
• Trapezoidal, Square or Sine Wave Capability  
The HC5517B low cost, 3 REN ringing SLIC is designed to  
accommodate a wide variety of short loop applications and  
provides the same degree of flexibility as the high  
• Ringing from -80V Battery . . . . . . . . . . . . . . . . . . . 75V  
P-P  
performance HC5517. The flexible features include open  
circuit tip to ring DC voltages, user defined ringing  
• Ringing from -75V Battery . . . . . . . . . . . . . . . . . . . 70V  
• Ringing Current Independent of Loop Current Setting  
• Ringing Crest Factor Independent of REN Loading  
• Latchup Immune to Inductive Kick Back and Hot Plug  
• Fax, Answering Machine and MTU Compatible  
• Resistive and Complex Impedance Matching  
• Programmable Loop Current Limit  
P-P  
waveforms, ring trip detection thresholds, and loop current  
limits that can be tailored for many applications. Additional  
features of the HC5517B are complex impedance matching,  
pulse metering, and transhybrid balance. The HC5517B is  
designed for use in short loop, low cost systems where  
traditional ring generation is not economically feasible.  
The device is manufactured in a high voltage Dielectric  
Isolation (DI) process. The DI process provides substrate  
latch up immunity, resulting in a robust system design. A  
thermal shutdown with an alarm output and line fault  
protection are also included for operation in harsh  
environments.  
• Switch Hook, Ring Trip and Ground Key Detection  
• Single Low Voltage +5V Supply  
Applications  
• Solid State Line Interface Circuit for Hybrid Fiber Coax, Set  
Top Box, Voice/Data Modems  
Ordering Information  
PART  
NUMBER  
TEMP. RANGE  
• Related Literature  
o
( C)  
PACKAGE  
28 Ld PLCC  
28 SOIC  
PKG. NO.  
N28.45  
- AN9607, Impedance Matching Design Equations  
- AN9628, AC Voltage Gain  
HC5517BCM  
HC5517BCB  
0 to 75  
0 to 75  
M28.3  
- AN9636, Implementing an Analog Port for ISDN  
- AN549, The HC-5502/4X Telephone SLIC  
Block Diagram  
V
V
RX  
TX  
TIP FEED  
4-WIRE  
INTERFACE  
TIP SENSE  
2-WIRE  
INTERFACE  
V
RING  
LOOP CURRENT  
DETECTOR  
RING FEED  
- IN 1  
-
RING SENSE 1  
RING SENSE 2  
+
FAULT  
DETECTOR  
OUT 1  
V
REF  
RTI  
CURRENT  
LIMIT  
SHD  
ALM  
V
BAT  
RING TRIP  
DETECTOR  
V
CC  
I
LIMIT  
BIAS  
RTD  
RDO  
AGND  
BGND  
RELAY  
DRIVER  
IIL LOGIC INTERFACE  
F1  
F0  
RS TST  
RDI  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999  
61  
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中文翻译

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