HC5503PRC
®
Data Sheet
J une 2004
FN4806.3
Low Cos t SLIC For Large Telecom
Switches
Features
• Wide Operating Battery Range (-40V to -58V)
• Single Additional +5V Supply
The HC5503PRC is a low cost SLIC optimized for large
Telecom switches. It combines a flexible voltage feed
architecture with the Intersil latch-free DI bonded wafer
process, to provide a low component count, carrier class
solution at very low cost. The re-configurable design permits
simple, economical solutions for campus-wide call center
and PBX applications. External components can be used in
conjunction with the high battery voltage capability to meet
the complex impedance and long loop drive requirements of
Central Office switches, worldwide.
• 30mA Short Loop Current Limit
• Ring Relay Driver
• Switch Hook and Ring Trip Detect
• Low On-Hook Power Consumption
• On-Hook Transmission
• ITU-T Longitudinal Balance Performance
• Loop Power Denial Function
Ordering Information
• Thermal Protection
TEMP.
PKG.
• Supports Tip, Ring or Balanced Ringing Schemes
• Low Profile SO and QFN Surface Mount Packaging
• Pb-free Available
PART NUMBER RANGE (°C)
PACKAGE
24 Ld SOIC
24 Ld SOIC (Pb-free)
DWG. #
HC5503PRCB
0 to 70
0 to 70
M24.3
M24.3
HC5503PRCBZ
(Note)
Applications
HC5503PRCBZ96
(Note)
0 to 70
24 Ld SOIC Tape & Reel M24.3
(Pb-free)
• Central Office, PBX, Call Centers
HC5503PRCR
0 to 70
0 to 70
32 Ld 7x7 QFN
L32.7x7
L32.7x7
• Related Literature
HC5503PRCRZ
(Note)
32 Ld 7x7 QFN
(Pb-free)
- AN571, Using Ring Sync with HC-5502A and HC-5504
SLICs
HC5503PRCRZ96
(Note)
0 to 70
32 Ld 7x7 QFN
Tape & Reel (Pb-free)
L32.7x7
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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