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HB56UW873E-6A PDF预览

HB56UW873E-6A

更新时间: 2024-09-14 23:54:47
品牌 Logo 应用领域
其他 - ETC 内存集成电路动态存储器
页数 文件大小 规格书
27页 388K
描述
x72 EDO Page Mode DRAM Module

HB56UW873E-6A 数据手册

 浏览型号HB56UW873E-6A的Datasheet PDF文件第2页浏览型号HB56UW873E-6A的Datasheet PDF文件第3页浏览型号HB56UW873E-6A的Datasheet PDF文件第4页浏览型号HB56UW873E-6A的Datasheet PDF文件第5页浏览型号HB56UW873E-6A的Datasheet PDF文件第6页浏览型号HB56UW873E-6A的Datasheet PDF文件第7页 
HB56UW873E-A Series  
64MB Buffered EDO DRAM DIMM  
8-Mword × 72-bit, 4k Refresh, 1 Bank Module  
(9 pcs of 8M × 8 components)  
ADE-203-821B (Z)  
Rev. 2.0  
Nov. 20, 1997  
Description  
The HB56UW873E-A belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been  
developed as an optimized main memory solution for 4 and 8 Byte processor applications. The  
HB56UW873E-A is a 8M × 72 dynamic RAM module, mounted 9 pieces of 64-Mbit DRAM  
(HM5165805A) sealed in TSOP package and 2 pieces of 16-bit BiCMOS line driver sealed in TSSOP  
package. The HB56UW873E-A offers Extended Data Out (EDO) Page Mode as a high speed access mode.  
An outline of the HB56UW873E-A is 168-pin socket type package (dual lead out). Therefore, the  
HB56UW873E-A makes high density mounting possible without surface mount technology. The  
HB56UW873E-A provides common data inputs and outputs. Decoupling capacitors are mounted beside  
each TSOP on the its module board.  
Features  
168-pin socket type package (Dual lead out)  
Lead pitch: 1.27 mm  
Single 3.3 V supply: 3.3 V +0.3 V/–0.15 V (HB56UW873E-5AR)  
3.3 V ± 0.3 V (HB56UW873E-6A/7A)  
High speed  
Access time: tRAC = 50 ns /60 ns /70 ns (max)  
Access time: tCAC = 18 ns /20 ns /23 ns (max)  
Low power dissipation  
Active mode: 6.32 mW/5.38 W/4.73 W (max)  
Standby mode (TTL): 100 mW (max)  
Buffered input except RAS and DQ  
4 byte interleave enabled, dual address input (A0/B0)  
EDO page mode capability  
4,096 refresh cycle: 64 ms  
2 variations of refresh  
RAS-only refresh  
CAS-before-RAS refresh  
This Material Copyrighted by Its Respective Manufacturer  

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