5秒后页面跳转
GS881E18BGD-200V PDF预览

GS881E18BGD-200V

更新时间: 2024-11-11 05:10:55
品牌 Logo 应用领域
GSI 存储静态存储器
页数 文件大小 规格书
36页 1524K
描述
512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs

GS881E18BGD-200V 数据手册

 浏览型号GS881E18BGD-200V的Datasheet PDF文件第2页浏览型号GS881E18BGD-200V的Datasheet PDF文件第3页浏览型号GS881E18BGD-200V的Datasheet PDF文件第4页浏览型号GS881E18BGD-200V的Datasheet PDF文件第5页浏览型号GS881E18BGD-200V的Datasheet PDF文件第6页浏览型号GS881E18BGD-200V的Datasheet PDF文件第7页 
GS881E18/32/36B(T/D)-xxxV  
250 MHz150 MHz  
100-Pin TQFP & 165-bump BGA  
Commercial Temp  
Industrial Temp  
512K x 18, 256K x 32, 256K x 36  
9Mb Sync Burst SRAMs  
1.8 V or 2.5 V V  
DD  
1.8 V or 2.5 V I/O  
Linear Burst Order (LBO) input. The Burst function need not  
be used. New addresses can be loaded on every cycle with no  
degradation of chip performance.  
Features  
• FT pin for user-configurable flow through or pipeline  
operation  
• Dual Cycle Deselect (DCD) operation  
• IEEE 1149.1 JTAG-compatible Boundary Scan  
• 1.8 V or 2.5 V +10%/–10% core power supply  
• 1.8 V or 2.5 V I/O supply  
• LBO pin for Linear or Interleaved Burst mode  
• Internal input resistors on mode pins allow floating mode pins  
• Default to Interleaved Pipeline mode  
• Byte Write (BW) and/or Global Write (GW) operation  
• Internal self-timed write cycle  
• Automatic power-down for portable applications  
• JEDEC-standard 100-lead TQFP and 165-bump BGA  
packages  
• RoHS-compliant 100-lead TQFP and 165-bump BGA  
packages available  
Flow Through/Pipeline Reads  
The function of the Data Output register can be controlled by  
the user via the FT mode pin (Pin 14). Holding the FT mode  
pin low places the RAM in Flow Through mode, causing  
output data to bypass the Data Output Register. Holding FT  
high places the RAM in Pipeline mode, activating the rising-  
edge-triggered Data Output Register.  
DCD Pipelined Reads  
The GS881E18/32/36B(T/D)-xxxV is a DCD (Dual Cycle  
Deselect) pipelined synchronous SRAM. SCD (Single Cycle  
Deselect) versions are also available. DCD SRAMs pipeline  
disable commands to the same degree as read commands. DCD  
RAMs hold the deselect command for one full cycle and then  
begin turning off their outputs just after the second rising edge  
of clock.  
Functional Description  
Byte Write and Global Write  
Applications  
Byte write operation is performed by using Byte Write enable  
(BW) input combined with one or more individual byte write  
signals (Bx). In addition, Global Write (GW) is available for  
writing all bytes at one time, regardless of the Byte Write  
control inputs.  
The GS881E18/32/36B(T/D)-xxxV is a 9,437,184-bit high  
performance synchronous SRAM with a 2-bit burst address  
counter. Although of a type originally developed for Level 2  
Cache applications supporting high performance CPUs, the  
device now finds application in synchronous SRAM  
applications, ranging from DSP main store to networking chip  
set support.  
Sleep Mode  
Low power (Sleep mode) is attained through the assertion  
(High) of the ZZ signal, or by stopping the clock (CK).  
Memory data is retained during Sleep mode.  
Controls  
Addresses, data I/Os, chip enable (E1), address burst control  
inputs (ADSP, ADSC, ADV) and write control inputs (Bx,  
BW, GW) are synchronous and are controlled by a positive-  
edge-triggered clock input (CK). Output enable (G) and power  
down control (ZZ) are asynchronous inputs. Burst cycles can  
be initiated with either ADSP or ADSC inputs. In Burst mode,  
subsequent burst addresses are generated internally and are  
controlled by ADV. The burst address counter may be  
configured to count in either linear or interleave order with the  
Core and Interface Voltages  
The GS881E18/32/36B(T/D)-xxxV operates on a 1.8 V or 2.5  
V power supply. All input are 2.5 V and 1.8 V compatible.  
Separate output power (V  
) pins are used to decouple  
DDQ  
output noise from the internal circuits and are 2.5 V and 1.8 V  
compatible.  
Paramter Synopsis  
-250  
-200  
-150  
Unit  
tKQ  
3.0  
4.0  
3.0  
5.0  
3.8  
6.7  
ns  
ns  
tCycle  
Pipeline  
3-1-1-1  
Curr (x18)  
Curr (x32/x36)  
200  
230  
170  
195  
140  
160  
mA  
mA  
tKQ  
5.5  
5.5  
6.5  
6.5  
7.5  
7.5  
ns  
ns  
tCycle  
Flow Through  
2-1-1-1  
Curr (x18)  
Curr (x32/x36)  
160  
185  
140  
160  
128  
145  
mA  
mA  
Rev: 1.00 6/2006  
1/36  
© 2006, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

与GS881E18BGD-200V相关器件

型号 品牌 获取价格 描述 数据表
GS881E18BGD-225IT GSI

获取价格

Cache SRAM, 512KX18, 6ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
GS881E18BGD-225T GSI

获取价格

Cache SRAM, 512KX18, 6ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
GS881E18BGD-250 GSI

获取价格

512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
GS881E18BGD-250I GSI

获取价格

512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
GS881E18BGD-250IT GSI

获取价格

Cache SRAM, 512KX18, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-1
GS881E18BGD-250IV GSI

获取价格

512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
GS881E18BGD-250IVT GSI

获取价格

暂无描述
GS881E18BGD-250T GSI

获取价格

Cache SRAM, 512KX18, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-1
GS881E18BGD-250V GSI

获取价格

512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
GS881E18BGD-300 GSI

获取价格

512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs