是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | BGA, BGA119,7X17,50 |
针数: | 119 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.2.B | HTS代码: | 8542.32.00.41 |
风险等级: | 5.84 | 最长访问时间: | 7.5 ns |
其他特性: | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 最大时钟频率 (fCLK): | 150 MHz |
I/O 类型: | COMMON | JESD-30 代码: | R-PBGA-B119 |
JESD-609代码: | e0 | 长度: | 22 mm |
内存密度: | 18874368 bit | 内存集成电路类型: | ZBT SRAM |
内存宽度: | 18 | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 119 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 1MX18 | |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA119,7X17,50 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 2.5,2.5/3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.99 mm | 最大待机电流: | 0.02 A |
最小待机电流: | 2.38 V | 子类别: | SRAMs |
最大压摆率: | 0.17 mA | 最大供电电压 (Vsup): | 2.7 V |
最小供电电压 (Vsup): | 2.3 V | 标称供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 14 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
GS8162Z18B-150I | GSI |
获取价格 |
18Mb Pipelined and Flow Through Synchronous NBT SRAM | |
GS8162Z18B-150IT | GSI |
获取价格 |
ZBT SRAM, 1MX18, 7.5ns, CMOS, PBGA119, FBGA-119 | |
GS8162Z18B-150T | GSI |
获取价格 |
ZBT SRAM, 1MX18, 7.5ns, CMOS, PBGA119, FBGA-119 | |
GS8162Z18B-166 | GSI |
获取价格 |
18Mb Pipelined and Flow Through Synchronous NBT SRAM | |
GS8162Z18B-166I | GSI |
获取价格 |
18Mb Pipelined and Flow Through Synchronous NBT SRAM | |
GS8162Z18B-166IT | GSI |
获取价格 |
ZBT SRAM, 1MX18, 7ns, CMOS, PBGA119, FBGA-119 | |
GS8162Z18B-166T | GSI |
获取价格 |
ZBT SRAM, 1MX18, 7ns, CMOS, PBGA119, FBGA-119 | |
GS8162Z18B-200 | GSI |
获取价格 |
18Mb Pipelined and Flow Through Synchronous NBT SRAM | |
GS8162Z18B-200I | GSI |
获取价格 |
18Mb Pipelined and Flow Through Synchronous NBT SRAM | |
GS8162Z18B-200IT | GSI |
获取价格 |
ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA119, FBGA-119 |