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GS81314PQ18GK-133I PDF预览

GS81314PQ18GK-133I

更新时间: 2024-09-25 00:57:55
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GSI /
页数 文件大小 规格书
39页 490K
描述
Burst of 2 Multi-Bank ECCRAM

GS81314PQ18GK-133I 数据手册

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GS81314PQ18/36GK-133/120/106  
Up to 1333 MHz  
260-Pin BGA  
Com & Ind Temp  
POD I/O  
144Mb SigmaQuad-IVe™  
Burst of 2 Multi-Bank ECCRAM™  
1.25V ~ 1.3V V  
DD  
1.2V ~ 1.3V V  
DDQ  
Features  
Clocking and Addressing Schemes  
• 4Mb x 36 and 8Mb x 18 organizations available  
• Organized as 16 logical memory banks  
• 1333 MHz maximum operating frequency  
• 2.666 BT/s peak transaction rate (in billions per second)  
• 192 Gb/s peak data bandwidth (in x36 devices)  
• Separate I/O DDR Data Buses  
The GS81314PQ18/36GK SigmaQuad-IVe ECCRAMs are  
synchronous devices. They employ three pairs of positive and  
negative input clocks; one pair of master clocks, CK and CK,  
and two pairs of write data clocks, KD[1:0] and KD[1:0]. All  
six input clocks are single-ended; that is, each is received by a  
dedicated input buffer.  
• Non-multiplexed DDR Address Bus  
CK and CK are used to latch address and control inputs, and to  
control all output timing. KD[1:0] and KD[1:0] are used solely  
to latch data inputs.  
• Two operations - Read and Write - per clock cycle  
• Certain address/bank restrictions on Read and Write ops  
• Burst of 2 Read and Write operations  
• 6 cycle Read Latency  
• On-chip ECC with virtually zero SER  
• Loopback signal timing training capability  
• 1.25V ~ 1.3V nominal core voltage  
Each internal read and write operation in a SigmaQuad-IVe B2  
ECCRAM is two times wider than the device I/O bus. An input  
data bus de-multiplexer is used to accumulate incoming data  
before it is simultaneously written to the memory array. An  
output data multiplexer is used to capture the data produced  
from a single memory array read and then route it to the  
appropriate output drivers as needed. Therefore, the address  
field of a SigmaQuad-IVe B2 ECCRAM is always one address  
pin less than the advertised index depth (e.g. the 8M x 18 has  
4M addressable index).  
• 1.2V ~ 1.3V POD I/O interface  
• Configuration registers  
• Configurable ODT (on-die termination)  
• ZQ pin for programmable driver impedance  
• ZT pin for programmable ODT impedance  
• IEEE 1149.1 JTAG-compliant Boundary Scan  
• 260-pin, 14 mm x 22 mm, 1 mm ball pitch, 6/6 RoHS-  
compliant BGA package  
On-Chip Error Correction Code  
GSI's ECCRAMs implement an ECC algorithm that detects  
and corrects all single-bit memory errors, including those  
induced by SER events such as cosmic rays, alpha particles,  
etc. The resulting Soft Error Rate of these devices is  
anticipated to be <0.002 FITs/Mb — a 5-order-of-magnitude  
improvement over comparable SRAMs with no on-chip ECC,  
which typically have an SER of 200 FITs/Mb or more.  
SigmaQuad-IVeFamily Overview  
SigmaQuad-IVe ECCRAMs are the Separate I/O half of the  
SigmaQuad-IVe/SigmaDDR-IVe family of high performance  
ECCRAMs. Although similar to GSI's third generation of  
networking SRAMs (the SigmaQuad-IIIe/SigmaDDR-IIIe  
family), these fourth generation devices offer several new  
features that help enable significantly higher performance.  
All quoted SER values are at sea level in New York City.  
Parameter Synopsis  
V
Speed Grade  
Max Operating Frequency  
Read Latency  
DD  
-133  
-120  
-106  
1333 MHz  
1200 MHz  
1066 MHz  
6 cycles  
6 cycles  
6 cycles  
1.2V to 1.35V  
1.2V to 1.35V  
1.2V to 1.35V  
Rev: 1.09 5/2016  
1/39  
© 2014, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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