是否Rohs认证: | 符合 | 生命周期: | Not Recommended |
零件包装代码: | BGA | 包装说明: | LBGA, |
针数: | 165 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.2.B | HTS代码: | 8542.32.00.41 |
Factory Lead Time: | 12 weeks | 风险等级: | 5.05 |
Is Samacsys: | N | 最长访问时间: | 0.45 ns |
其他特性: | PIPELINED ARCHITECTURE | JESD-30 代码: | R-PBGA-B165 |
长度: | 17 mm | 内存密度: | 134217728 bit |
内存集成电路类型: | DDR SRAM | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 165 |
字数: | 16777216 words | 字数代码: | 16000000 |
工作模式: | SYNCHRONOUS | 组织: | 16MX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 1.5 mm |
最大供电电压 (Vsup): | 1.9 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 15 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
GS81302D06GE-400IT | GSI |
获取价格 |
DDR SRAM, 16MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | |
GS81302D06GE-400T | GSI |
获取价格 |
DDR SRAM, 16MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | |
GS81302D06GE-450 | GSI |
获取价格 |
DDR SRAM, 16MX8, 0.37ns, CMOS, PBGA165, FPBGA-165 | |
GS81302D06GE-450I | GSI |
获取价格 |
Dual Double Data Rate interface | |
GS81302D06GE-450IT | GSI |
获取价格 |
DDR SRAM, 16MX8, 0.37ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | |
GS81302D06GE-500 | GSI |
获取价格 |
165 BGA | |
GS81302D06GE-500I | GSI |
获取价格 |
JEDEC-standard pinout and package | |
GS81302D06GE-500T | GSI |
获取价格 |
DDR SRAM, 16MX8, 0.37ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | |
GS81302D07E-300 | GSI |
获取价格 |
144Mb SigmaQuad-IITM Burst of 4 SRAM | |
GS81302D07E-300I | GSI |
获取价格 |
DDR SRAM, 16MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 |