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GBU601 PDF预览

GBU601

更新时间: 2024-02-11 22:11:04
品牌 Logo 应用领域
戈采 - FCI 二极管局域网
页数 文件大小 规格书
2页 127K
描述
6.0Amps Glass Passivated Single Phase Silico n Bridge

GBU601 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:R-PSFM-T4Reach Compliance Code:compliant
风险等级:5.63最小击穿电压:100 V
配置:BRIDGE, 4 ELEMENTS二极管元件材料:SILICON
二极管类型:BRIDGE RECTIFIER DIODEJESD-30 代码:R-PSFM-T4
最大非重复峰值正向电流:150 A元件数量:4
相数:1端子数量:4
最高工作温度:150 °C最低工作温度:-55 °C
最大输出电流:6 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED最大重复峰值反向电压:100 V
表面贴装:NO端子面层:Pure Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

GBU601 数据手册

 浏览型号GBU601的Datasheet PDF文件第2页 
6.0Amps Glass Passivated  
Single Phase Silicon Bridge  
Machamical Dimensions  
+
4.2 0.2  
+
21.9 0.5  
+
3.85 0.25  
Descriptions  
+
4.4 0.2  
+
1.95 0.25  
+
18.6 0.3  
+
20.4 0.3  
1.9 R. TYP.  
(2PLACES)  
+
_
10.8 0.5  
~
+
~
+
3.4 0.2  
+
16.0 0.4  
+
0.2  
1.3  
+
5.1 0.5  
GBU  
Dimensions in millimeters(1mm =0.0394")  
Features  
Mechanical Data  
Case: Molded plastic body  
Ideal for P.C. Board mounting  
Terminals: Plated leads solderable per MIL-STD-202,  
Method 208  
High surge current capability  
This series is UL listed under the Recognized  
Component Index, file number E142814  
The plastic material used carries Underwriters  
Laboratory flammability recognition 94V-0  
High temperature soldering guaranteed 265 C /10  
seconds at 5 lbs (2.3kg) tension  
Mounting Position:: Any  
Weight: 3.8 grams (approx)  
Maximum Ratings & Thermal Characteristics  
Rating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz.  
For Capacitive load derate current by 20%.  
GBU GBU GBU GBU GBU GBU GBU GBU  
Parameter  
Symbol  
VRRM  
VRMS  
VDC  
unit  
600  
50  
601 602  
100 200  
604  
400  
606 608 610 612  
600 800 1000 1200  
V
Maximum repetitive peak reverse voltage  
Maximum RMS bridge input voltage  
Maximum DC blocking voltage  
35  
50  
70 140  
100 200  
280  
400  
420  
560 700 840  
V
V
600 800 1000 1200  
Maximum average forward rectified  
output current at TA=100 C  
6.0  
IF(AV)  
A
Peak forward surge current single sine-wave  
superimposed on rated load (JEDEC Method)  
175  
A
IFSM  
I2 t  
2sec  
A
127  
2.2  
Rating for fusing ( t<8.3ms)  
C / W  
Typical thermal resistance per element(1)  
ReJA  
TJ,  
TSTG  
Operating junction and storage temperature  
range  
-55 to + 150  
1.1  
Max. instantaneous forward voltage drop  
per leg at 6.0A  
VF  
V
Max. DC reverse current at rated Ta=25C  
Max. DC reverse current at rated Ta=125C  
IR  
IR  
5.0  
uA  
uA  
500  
Notes: Thermal resistance from Junction to Ambient on PC board mounting  

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