TechnischeꢀInformationꢀ/ꢀTechnicalꢀInformation
IGBT-Module
IGBT-modules
FP25R12W2T4_B11
EasyPIM™2BꢀModulꢀPressFITꢀmitꢀTrench/FeldstoppꢀIGBT4ꢀundꢀEmitterꢀControlled4ꢀDiodeꢀ
EasyPIM™2BꢀmoduleꢀPressFITꢀwithꢀtrench/fieldstopꢀIGBT4ꢀandꢀEmitterꢀControlled4ꢀDiodeꢀ
VorläufigeꢀDaten
PreliminaryꢀData
IGBT,Wechselrichterꢀ/ꢀIGBT,Inverter
HöchstzulässigeꢀWerteꢀ/ꢀMaximumꢀRatedꢀValues
Kollektor-Emitter-Sperrspannung
Collector-emitterꢀvoltage
Tvj = 25°C
VCES
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
1200
ꢀ
ꢀ
ꢀ
V
Kollektor-Dauergleichstrom
ContinuousꢀDCꢀcollectorꢀcurrent
TC = 100°C, Tvj max = 175°C
TC = 25°C, Tvj max = 175°C
IC nom
IC
25
39
A
A
PeriodischerꢀKollektor-Spitzenstrom
Repetitiveꢀpeakꢀcollectorꢀcurrent
tP = 1 ms
ICRM
Ptot
50
A
Gesamt-Verlustleistung
Totalꢀpowerꢀdissipation
TC = 25°C, Tvj max = 175°C
175
ꢀ W
Gate-Emitter-Spitzenspannung
Gate-emitterꢀpeakꢀvoltage
ꢀ
VGES
+/-20
ꢀ
V
CharakteristischeꢀWerteꢀ/ꢀCharacteristicꢀValues
min. typ. max.
Kollektor-Emitter-Sättigungsspannung
Collector-emitterꢀsaturationꢀvoltage
IC = 25 A, VGE = 15 V
IC = 25 A, VGE = 15 V
IC = 25 A, VGE = 15 V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
1,85 2,25
2,15
2,25
V
V
V
VCE sat
Gate-Schwellenspannung
Gateꢀthresholdꢀvoltage
IC = 0,80 mA, VCE = VGE, Tvj = 25°C
VGE = -15 V ... +15 V
VGEth
QG
5,2
5,8
0,20
0,0
1,45
0,05
ꢀ
6,4
V
µC
Ω
Gateladung
Gateꢀcharge
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
InternerꢀGatewiderstand
Internalꢀgateꢀresistor
Tvj = 25°C
RGint
Cies
Cres
ICES
IGES
td on
Eingangskapazität
Inputꢀcapacitance
f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V
f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V
VCE = 1200 V, VGE = 0 V, Tvj = 25°C
VCE = 0 V, VGE = 20 V, Tvj = 25°C
nF
nF
Rückwirkungskapazität
Reverseꢀtransferꢀcapacitance
Kollektor-Emitter-Reststrom
Collector-emitterꢀcut-offꢀcurrent
1,0 mA
Gate-Emitter-Reststrom
Gate-emitterꢀleakageꢀcurrent
ꢀ
400 nA
µs
Einschaltverzögerungszeit,ꢀinduktiveꢀLast
Turn-onꢀdelayꢀtime,ꢀinductiveꢀload
IC = 25 A, VCE = 600 V
VGE = ±15 V
RGon = 20 Ω
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
0,026
0,026
0,026
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
µs
µs
Anstiegszeit,ꢀinduktiveꢀLast
Riseꢀtime,ꢀinductiveꢀload
IC = 25 A, VCE = 600 V
VGE = ±15 V
RGon = 20 Ω
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
0,016
0,02
0,021
µs
µs
µs
tr
td off
tf
Abschaltverzögerungszeit,ꢀinduktiveꢀLast
Turn-offꢀdelayꢀtime,ꢀinductiveꢀload
IC = 25 A, VCE = 600 V
VGE = ±15 V
RGoff = 20 Ω
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
0,19
0,28
0,30
µs
µs
µs
Fallzeit,ꢀinduktiveꢀLast
Fallꢀtime,ꢀinductiveꢀload
IC = 25 A, VCE = 600 V
VGE = ±15 V
RGoff = 20 Ω
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
0,18
0,21
0,22
µs
µs
µs
EinschaltverlustenergieꢀproꢀPuls
Turn-onꢀenergyꢀlossꢀperꢀpulse
IC = 25 A, VCE = 600 V, LS = 35 nH
VGE = ±15 V, di/dt = 1700 A/µs (Tvj = 150°C) Tvj = 125°C
RGon = 20 Ω
Tvj = 25°C
1,60
2,40
2,60
mJ
mJ
mJ
Eon
Eoff
Tvj = 150°C
AbschaltverlustenergieꢀproꢀPuls
Turn-offꢀenergyꢀlossꢀperꢀpulse
IC = 25 A, VCE = 600 V, LS = 35 nH
VGE = ±15 V, du/dt = 3600 V/µs (Tvj = 150°C)Tvj = 125°C
RGoff = 20 Ω
Tvj = 25°C
1,45
2,15
2,35
mJ
mJ
mJ
ꢀ
ꢀ
Tvj = 150°C
Kurzschlußverhalten
SCꢀdata
VGE ≤ 15 V, VCC = 800 V
VCEmax = VCES -LsCE ·di/dt
ISC
ꢀ
tP ≤ 10 µs, Tvj = 150°C
90
A
Wärmewiderstand,ꢀChipꢀbisꢀGehäuse
Thermalꢀresistance,ꢀjunctionꢀtoꢀcase
proꢀIGBTꢀ/ꢀperꢀIGBT
RthJC
RthCH
Tvj op
ꢀ
ꢀ
0,75 0,85 K/W
Wärmewiderstand,ꢀGehäuseꢀbisꢀKühlkörper proꢀIGBTꢀ/ꢀperꢀIGBT
Thermalꢀresistance,ꢀcaseꢀtoꢀheatsink
0,70
K/W
°C
λ
Pasteꢀ=ꢀ1ꢀW/(m·K)ꢀꢀꢀ/ꢀꢀꢀꢀλgreaseꢀ=ꢀ1ꢀW/(m·K)
TemperaturꢀimꢀSchaltbetrieb
Temperatureꢀunderꢀswitchingꢀconditions
ꢀ
-40
ꢀ
150
preparedꢀby:ꢀCM
approvedꢀby:ꢀRS
dateꢀofꢀpublication:ꢀ2013-11-04
revision:ꢀ2.1
1