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FP25R12W2T4B11BOMA1 PDF预览

FP25R12W2T4B11BOMA1

更新时间: 2024-11-05 21:08:31
品牌 Logo 应用领域
英飞凌 - INFINEON 局域网功率控制晶体管
页数 文件大小 规格书
11页 618K
描述
Insulated Gate Bipolar Transistor, 39A I(C), 1200V V(BR)CES, N-Channel, MODULE-35

FP25R12W2T4B11BOMA1 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-XUFM-X23Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:2.08
外壳连接:ISOLATED最大集电极电流 (IC):39 A
集电极-发射极最大电压:1200 V配置:COMPLEX
JESD-30 代码:R-XUFM-X23元件数量:7
端子数量:23封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
表面贴装:NO端子形式:UNSPECIFIED
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):520 ns标称接通时间 (ton):47 ns
Base Number Matches:1

FP25R12W2T4B11BOMA1 数据手册

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TechnischeꢀInformationꢀ/ꢀTechnicalꢀInformation  
IGBT-Module  
IGBT-modules  
FP25R12W2T4_B11  
EasyPIM™2BꢀModulꢀPressFITꢀmitꢀTrench/FeldstoppꢀIGBT4ꢀundꢀEmitterꢀControlled4ꢀDiodeꢀ  
EasyPIM™2BꢀmoduleꢀPressFITꢀwithꢀtrench/fieldstopꢀIGBT4ꢀandꢀEmitterꢀControlled4ꢀDiodeꢀ  
VorläufigeꢀDaten  
PreliminaryꢀData  
IGBT,Wechselrichterꢀ/ꢀIGBT,Inverter  
HöchstzulässigeꢀWerteꢀ/ꢀMaximumꢀRatedꢀValues  
Kollektor-Emitter-Sperrspannung  
Collector-emitterꢀvoltage  
Tvj = 25°C  
VCES  
1200  
V
Kollektor-Dauergleichstrom  
ContinuousꢀDCꢀcollectorꢀcurrent  
TC = 100°C, Tvj max = 175°C  
TC = 25°C, Tvj max = 175°C  
IC nom  
IC  
25  
39  
A
A
PeriodischerꢀKollektor-Spitzenstrom  
Repetitiveꢀpeakꢀcollectorꢀcurrent  
tP = 1 ms  
ICRM  
Ptot  
50  
A
Gesamt-Verlustleistung  
Totalꢀpowerꢀdissipation  
TC = 25°C, Tvj max = 175°C  
175  
W  
Gate-Emitter-Spitzenspannung  
Gate-emitterꢀpeakꢀvoltage  
VGES  
+/-20  
V
CharakteristischeꢀWerteꢀ/ꢀCharacteristicꢀValues  
min. typ. max.  
Kollektor-Emitter-Sättigungsspannung  
Collector-emitterꢀsaturationꢀvoltage  
IC = 25 A, VGE = 15 V  
IC = 25 A, VGE = 15 V  
IC = 25 A, VGE = 15 V  
Tvj = 25°C  
Tvj = 125°C  
Tvj = 150°C  
1,85 2,25  
2,15  
2,25  
V
V
V
VCE sat  
Gate-Schwellenspannung  
Gateꢀthresholdꢀvoltage  
IC = 0,80 mA, VCE = VGE, Tvj = 25°C  
VGE = -15 V ... +15 V  
VGEth  
QG  
5,2  
5,8  
0,20  
0,0  
1,45  
0,05  
6,4  
V
µC  
Gateladung  
Gateꢀcharge  
InternerꢀGatewiderstand  
Internalꢀgateꢀresistor  
Tvj = 25°C  
RGint  
Cies  
Cres  
ICES  
IGES  
td on  
Eingangskapazität  
Inputꢀcapacitance  
f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V  
f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V  
VCE = 1200 V, VGE = 0 V, Tvj = 25°C  
VCE = 0 V, VGE = 20 V, Tvj = 25°C  
nF  
nF  
Rückwirkungskapazität  
Reverseꢀtransferꢀcapacitance  
Kollektor-Emitter-Reststrom  
Collector-emitterꢀcut-offꢀcurrent  
1,0 mA  
Gate-Emitter-Reststrom  
Gate-emitterꢀleakageꢀcurrent  
400 nA  
µs  
Einschaltverzögerungszeit,ꢀinduktiveꢀLast  
Turn-onꢀdelayꢀtime,ꢀinductiveꢀload  
IC = 25 A, VCE = 600 V  
VGE = ±15 V  
RGon = 20 Ω  
Tvj = 25°C  
Tvj = 125°C  
Tvj = 150°C  
0,026  
0,026  
0,026  
µs  
µs  
Anstiegszeit,ꢀinduktiveꢀLast  
Riseꢀtime,ꢀinductiveꢀload  
IC = 25 A, VCE = 600 V  
VGE = ±15 V  
RGon = 20 Ω  
Tvj = 25°C  
Tvj = 125°C  
Tvj = 150°C  
0,016  
0,02  
0,021  
µs  
µs  
µs  
tr  
td off  
tf  
Abschaltverzögerungszeit,ꢀinduktiveꢀLast  
Turn-offꢀdelayꢀtime,ꢀinductiveꢀload  
IC = 25 A, VCE = 600 V  
VGE = ±15 V  
RGoff = 20 Ω  
Tvj = 25°C  
Tvj = 125°C  
Tvj = 150°C  
0,19  
0,28  
0,30  
µs  
µs  
µs  
Fallzeit,ꢀinduktiveꢀLast  
Fallꢀtime,ꢀinductiveꢀload  
IC = 25 A, VCE = 600 V  
VGE = ±15 V  
RGoff = 20 Ω  
Tvj = 25°C  
Tvj = 125°C  
Tvj = 150°C  
0,18  
0,21  
0,22  
µs  
µs  
µs  
EinschaltverlustenergieꢀproꢀPuls  
Turn-onꢀenergyꢀlossꢀperꢀpulse  
IC = 25 A, VCE = 600 V, LS = 35 nH  
VGE = ±15 V, di/dt = 1700 A/µs (Tvj = 150°C) Tvj = 125°C  
RGon = 20 Ω  
Tvj = 25°C  
1,60  
2,40  
2,60  
mJ  
mJ  
mJ  
Eon  
Eoff  
Tvj = 150°C  
AbschaltverlustenergieꢀproꢀPuls  
Turn-offꢀenergyꢀlossꢀperꢀpulse  
IC = 25 A, VCE = 600 V, LS = 35 nH  
VGE = ±15 V, du/dt = 3600 V/µs (Tvj = 150°C)Tvj = 125°C  
RGoff = 20 Ω  
Tvj = 25°C  
1,45  
2,15  
2,35  
mJ  
mJ  
mJ  
Tvj = 150°C  
Kurzschlußverhalten  
SCꢀdata  
VGE 15 V, VCC = 800 V  
VCEmax = VCES -LsCE ·di/dt  
ISC  
tP 10 µs, Tvj = 150°C  
90  
A
Wärmewiderstand,ꢀChipꢀbisꢀGehäuse  
Thermalꢀresistance,ꢀjunctionꢀtoꢀcase  
proꢀIGBTꢀ/ꢀperꢀIGBT  
RthJC  
RthCH  
Tvj op  
0,75 0,85 K/W  
Wärmewiderstand,ꢀGehäuseꢀbisꢀKühlkörper proꢀIGBTꢀ/ꢀperꢀIGBT  
Thermalꢀresistance,ꢀcaseꢀtoꢀheatsink  
0,70  
K/W  
°C  
λ
Pasteꢀ=ꢀ1ꢀW/(m·K)ꢀꢀꢀ/ꢀꢀꢀꢀλgreaseꢀ=ꢀ1ꢀW/(m·K)  
TemperaturꢀimꢀSchaltbetrieb  
Temperatureꢀunderꢀswitchingꢀconditions  
-40  
150  
preparedꢀby:ꢀCM  
approvedꢀby:ꢀRS  
dateꢀofꢀpublication:ꢀ2013-11-04  
revision:ꢀ2.1  
1

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