Datasheet > FMM5829X

FMM5829X

更新时间： 2024-02-21 16:59:58

品牌	Logo	应用领域
EUDYNA		放大器射频微波功率放大器
页数	文件大小	规格书
14页	259K
描述
K-Band Power Amplifier MMIC

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技术参数
数据手册

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FMM5829X 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	Reach Compliance Code：	unknown
风险等级：	5.17	Is Samacsys：	N
其他特性：	HIGH RELIABILITY	特性阻抗：	50 Ω
构造：	COMPONENT	最大输入功率 (CW)：	22 dBm
最大工作频率：	27000 MHz	最小工作频率：	21000 MHz
最高工作温度：	85 °C	最低工作温度：	-40 °C
射频/微波设备类型：	WIDE BAND MEDIUM POWER	Base Number Matches：	1

FMM5829X 数据手册

FMM5829X

K-Band Power Amplifier MMIC

■DIE ATTACH

1) The die-attach station must have accurate temperature control and an inert forming gas should

be used.

2) Chips should be kept at room temperature except during die-attach.

3) Place package or carrier on the heated stage.

4) Lightly grasp the chip edges by the longer side using tweezers.

Die attach conditions

Stage Temperature : 300 to 310 deg.C

Time : less than 15 seconds

AuSn Preform Volume : per next Figure

2500

2000

FMM5829X

1500

1000

500

Area of Chip Bach Surface (mm^2)

■ WIRE BONDING

The bonding equipment must be properly grounded. The following or equivalent equipment, tools,

materials, and conditions are recommended.

1) Bonding Equipment and Bonding Tool.

Bonding Equipment : West Bond Model 7400 (Manual Bonder)

Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl)

2) Bonding Wire

Material : Hard or Half hard gold

Diameter : 0.7 to 1.0 mil

3) Bonding Conditions

Method : Thermal Compression Bonding with Ultrasonic Power

Tool Force : 0.196 N ± 0.0196 N

Stage Temperature : 215 deg.C ± 5 deg.C

Tool Heater : None

Ultrasonic Power Transmitter : West Bond Model 1400

Duration : 150 mS/Bond

1...10 11 121314

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