Datasheet > FM307-BS-Q1-H

FM307-BS-Q1-H

更新时间： 2025-07-20 18:49:39

品牌	Logo	应用领域
美丽微 - FORMOSA		/
页数	文件大小	规格书
7页	59K
描述
Status : Active; Package : SMB-S; IO(A) : 3; VRRM(V) : 1000; VF Max.(V)@IF : 1.1; IF(A) : 3; IR Max.(µA)@VR : 5; VR(V) : 1000; AEC-Q101Qualified : Yes;

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中文翻译

获取价格

数据手册

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FM307-BS-Q1-H 数据手册

Chip General Purpose Rectifiers

Formosa MS

FM301-BS-Q1 THRU FM307-BS-Q1

Reel packing

COMPONENT

SPACING

INNER

BOX

REEL

DIA,

CARTON

SIZE

APPROX.

GROSS WEIGHT

REEL

(pcs)

BOX

(pcs)

PACKAGE

SMB-S

REEL SIZE

13"

CARTON

(pcs)

(m/m)

(kg)

(m/m)

4,000

8.0

8,000

335*335*38

330

350*330*360

64,000

13.0

Suggested thermal profiles for soldering processes

1.Storage environment: Temperature=5^oC~40^oC Humidity=55% 25%

2.Reflow soldering of surface-mount devices

Critical Zone

TL to TP

Ramp-up

Tsmax

Tsmin

Preheat

Ramp-down

t25^oC to Peak

Time

3.Reflow soldering

Profile Feature

Soldering Condition

Average ramp-up rate(T^Lto T^P)

<3^oC/sec

Preheat

-Temperature Min(Tsmin)

-Temperature Max(Tsmax)

-Time(min to max)(ts)

150^oC

200^oC

60~120sec

Tsmax to TL

-Ramp-upRate

<3^oC/sec

Time maintained above:

-Temperature(T^L)

-Time(tL)

217^oC

60~260sec

Peak Temperature(TP)

255^oC-0/+5^oC

10~30sec

Time within 5^oC of actual Peak

Temperature(tP)

Ramp-down Rate

<6^oC/sec

Time 25^oC to Peak Temperature

<6minutes

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

Issued Date

Revised Date

Revision

Page.

DS-121143-AEC 2015/03/10

Page 6

1...3 4 567

中文翻译

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