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FDZ2553NZ PDF预览

FDZ2553NZ

更新时间: 2024-11-24 22:14:35
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
6页 156K
描述
Monolithic Common Drain N-Channel 2.5V Specified PowerTrench BGA MOSFET

FDZ2553NZ 技术参数

是否无铅: 不含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:GRID ARRAY, R-PBGA-B18针数:18
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.31配置:SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):9.6 A
最大漏极电流 (ID):9.6 A最大漏源导通电阻:0.014 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PBGA-B18
JESD-609代码:e0湿度敏感等级:1
元件数量:2端子数量:18
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:GRID ARRAY峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):2.1 W
最大脉冲漏极电流 (IDM):20 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDZ2553NZ 数据手册

 浏览型号FDZ2553NZ的Datasheet PDF文件第2页浏览型号FDZ2553NZ的Datasheet PDF文件第3页浏览型号FDZ2553NZ的Datasheet PDF文件第4页浏览型号FDZ2553NZ的Datasheet PDF文件第5页浏览型号FDZ2553NZ的Datasheet PDF文件第6页 
July 2003  
FDZ2553NZ  
Ò
Monolithic Common Drain N-Channel 2.5V Specified PowerTrench BGA MOSFET  
General Description  
Features  
Combining Fairchild’s advanced 2.5V specified  
PowerTrench process with state-of -the-art BGA  
packaging, the FDZ2553N minimizes both PCB space  
· 9.6 A, 20 V. RDS(ON) = 14 mW @ VGS = 4.5 V  
RDS(ON) = 20 mW @ VGS = 2.5 V  
and RDS(ON)  
.
This common drain BGA MOSFET  
2
· Occupies only 0.10 cm of PCB area:  
1/3 the area of SO-8.  
embodies a breakthrough in packaging technology  
which enables the device to combine excellent thermal  
transfer characteristics, high current handling capability,  
ultra-low profile packaging, low gate charge, and low  
· Ultra-thin package: less than 0.70 mm height when  
mounted to PCB.  
RDS(ON)  
.
· ESD protection diode (note 3)  
Applications  
· Outstanding thermal transfer characteristics:  
significantly better than SO-8.  
· Battery management  
· Load switch  
· Ultra-low Qg x RDS(ON) figure-of-merit  
· Battery protection  
· High power and current handling capability  
D
S
D
S
S
D
S
S
Pin 1  
Q2  
Q1  
G
S
S
S
S
S
G
Pin1  
D
D
D
Top  
Bottom  
Absolute Maximum Ratings TA=25oC unless other wise noted  
Symbol  
VDSS  
VGSS  
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Drain Current – Continuous  
– Pulsed  
Ratings  
Units  
20  
±12  
9.6  
20  
V
V
A
ID  
(Note 1a)  
(Note 1a)  
PD  
Power Dissipation (Steady State)  
2.1  
W
TJ, TSTG  
Operating and Storage Junction Temperature Range  
–55 to +150  
°C  
Thermal Characteristics  
Thermal Resistance, Junction-to-Ambient  
(Note 1a)  
(Note 1)  
(Note 1)  
60  
6.3  
0.6  
RqJA  
RqJB  
RqJC  
°C/W  
Thermal Resistance, Junction-to-Ball  
Thermal Resistance, Junction-to-Case  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
2553NZ  
FDZ2553NZ  
7’’  
12mm  
3000 units  
Ó2003 Fairchild Semiconductor Corporation  
FDZ2553NZRev C (W)  

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