是否无铅: | 不含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | GRID ARRAY, R-PBGA-B18 | 针数: | 18 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
风险等级: | 5.31 | 配置: | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE |
最小漏源击穿电压: | 20 V | 最大漏极电流 (Abs) (ID): | 9.6 A |
最大漏极电流 (ID): | 9.6 A | 最大漏源导通电阻: | 0.014 Ω |
FET 技术: | METAL-OXIDE SEMICONDUCTOR | JESD-30 代码: | R-PBGA-B18 |
JESD-609代码: | e0 | 湿度敏感等级: | 1 |
元件数量: | 2 | 端子数量: | 18 |
工作模式: | ENHANCEMENT MODE | 最高工作温度: | 150 °C |
封装主体材料: | PLASTIC/EPOXY | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 260 |
极性/信道类型: | N-CHANNEL | 最大功率耗散 (Abs): | 2.1 W |
最大脉冲漏极电流 (IDM): | 20 A | 认证状态: | Not Qualified |
子类别: | FET General Purpose Power | 表面贴装: | YES |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
晶体管应用: | SWITCHING | 晶体管元件材料: | SILICON |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
FDZ2554P | FAIRCHILD |
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Monolithic Common Drain P-Channel 2.5V Specified PowerTrench | |
FDZ2554P_07 | FAIRCHILD |
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Monolithic Common Drain P-Channel 2.5V Specified PowerTrench BGA MOSFET | |
FDZ2554PZ | FAIRCHILD |
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Monolithic Common Drain P-Channel 2.5V Specified PowerTrench BGA MOSFET | |
FDZ25PG1E-K1019 | MOLEX |
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D Subminiature Connector, 25 Contact(s), Male, Solder Terminal, ROHS COMPLIANT | |
FDZ25PG1L-K1019 | MOLEX |
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D Subminiature Connector, 25 Contact(s), Male, Solder Terminal, ROHS COMPLIANT | |
FDZ25PG1LL-K1019 | MOLEX |
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D Type Connector, | |
FDZ25PG1LR-K1019 | MOLEX |
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D Type Connector, | |
FDZ25PG1M-K1019 | MOLEX |
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D Subminiature Connector, 25 Contact(s), Male, Solder Terminal, ROHS COMPLIANT | |
FDZ25PG1S-K1019 | MOLEX |
获取价格 |
D Subminiature Connector, 25 Contact(s), Male, Solder Terminal, ROHS COMPLIANT | |
FDZ25PG1SRK1019 | MOLEX |
获取价格 |
D Subminiature Connector |