FDZ2554P

更新时间： 2024-11-20 22:31:47

品牌	Logo	应用领域
飞兆/仙童 - FAIRCHILD		/
页数	文件大小	规格书
6页	184K
描述
Monolithic Common Drain P-Channel 2.5V Specified PowerTrench

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

FDZ2554P 数据手册

August 2004

FDZ2554P

Monolithic Common Drain P-Channel 2.5V Specified PowerTrench^BGA MOSFET

General Description

Features

Combining Fairchild’s advanced 2.5V specified

PowerTrench process with state-of-the-art BGA

packaging, the FDZ2554P minimizes both PCB space

• –6.5 A, –20 V. R_DS(ON)= 28 mΩ @ V_GS= –4.5 V

R_DS(ON)= 45 mΩ @ V_GS= –2.5 V

and R_DS(ON)

MOSFET embodies

This monolithic common drain BGA

breakthrough in packaging

• Occupies only 0.10 cm²of PCB area:

technology which enables the device to combine

excellent thermal transfer characteristics, high current

handling capability, ultra-low profile packaging, low gate

1/3 the area of SO-8

• Ultra-thin package: less than 0.80 mm height when

mounted to PCB

charge, and low R_DS(ON)

Applications

• Outstanding thermal transfer characteristics:

• Battery management

• Load switch

significantly better than SO-8

• Ultra-low Q_gx R_DS(ON)figure-of-merit

• Battery protection

• High power and current handling capability

Pin 1

Top

Bottom

Absolute Maximum Ratings T_A=25^oC unless otherwise noted

Symbol

Parameter

Ratings

–20

Units

V_DSS

Drain-Source Voltage

V_GSS

I_D

Gate-Source Voltage

Drain Current – Continuous

– Pulsed

±12

–6.5

–20

2.1

(Note 1a)

P_D

Power Dissipation (Steady State)

T_J, T_STG

Operating and Storage Junction Temperature Range

–55 to +150

°C

Thermal Characteristics

Thermal Resistance, Junction-to-Ambient

(Note 1a)

(Note 1b)

(Note 1)

6.3

0.6

R_θJA

R_θJB

R_θJC

°C/W

Thermal Resistance, Junction-to-Ball

Thermal Resistance, Junction-to-Case

Package Marking and Ordering Information

Device Marking

Device

Reel Size

Tape width

Quantity

2554P

FDZ2554P

7’’

12mm

3000 units

FDZ2554P Rev C5 (W)

2004 Fairchild Semiconductor Corporation

12 3 4 5 6

中文翻译

下载PDF

与FDZ2554P相关器件

型号	品牌	获取价格	描述	数据表
FDZ2554P_07	FAIRCHILD	获取价格	Monolithic Common Drain P-Channel 2.5V Specified PowerTrench BGA MOSFET
FDZ2554PZ	FAIRCHILD	获取价格	Monolithic Common Drain P-Channel 2.5V Specified PowerTrench BGA MOSFET
FDZ25PG1E-K1019	MOLEX	获取价格	D Subminiature Connector, 25 Contact(s), Male, Solder Terminal, ROHS COMPLIANT
FDZ25PG1L-K1019	MOLEX	获取价格	D Subminiature Connector, 25 Contact(s), Male, Solder Terminal, ROHS COMPLIANT
FDZ25PG1LL-K1019	MOLEX	获取价格	D Type Connector,
FDZ25PG1LR-K1019	MOLEX	获取价格	D Type Connector,
FDZ25PG1M-K1019	MOLEX	获取价格	D Subminiature Connector, 25 Contact(s), Male, Solder Terminal, ROHS COMPLIANT
FDZ25PG1S-K1019	MOLEX	获取价格	D Subminiature Connector, 25 Contact(s), Male, Solder Terminal, ROHS COMPLIANT
FDZ25PG1SRK1019	MOLEX	获取价格	D Subminiature Connector
FDZ25PG2E-K1019	MOLEX	获取价格	D Subminiature Connector, 25 Contact(s), Male, Solder Terminal, ROHS COMPLIANT

与FDZ2554P相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

28
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

21
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

50
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

48

产品中心

服务支持

精选活动

关于我们

帮助中心

FDZ2554P

FDZ2554P 数据手册

与FDZ2554P相关器件

与FDZ2554P相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

FDZ2554P

FDZ2554P 数据手册

与FDZ2554P相关器件

与FDZ2554P相关文章

您还可以找

您在本页遇到什么问题？