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FDZ2554P_07

更新时间： 2024-11-06 03:36:31
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
6页 234K
描述
Monolithic Common Drain P-Channel 2.5V Specified PowerTrench BGA MOSFET

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FDZ2554P_07 数据手册

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June 2007  
FDZ2554P  
®
Monolithic Common Drain P-Channel 2.5V Specified Power Trench BGA MOSFET  
-20V, -6.5A, 28mΩ  
Features  
General Description  
„ Max rDS(on) = 28mΩ at VGS = -4.5V, ID = -6.5A  
„ Max rDS(on) = 45mΩ at VGS = -2.5V, ID = -5A  
„ Occupies only 0.10 cm2 of PCB area: 1/3 the area of SO-8  
Combining Fairchild’s advanced 2.5V specified PowerTrench  
process with state-of-the-art BGA packaging, the FDZ2554P  
minimizes both PCB space and rDS(on). This monolithic common  
drain BGA MOSFET embodies a breakthrough in packaging  
technology which enables the device to combine excellent  
thermal transfer characteristics, high current handling capability,  
„ Ultra-thin package: less than 0.80 mm height when mounted  
to PCB  
ultra-low profile packaging, low gate charge, and low rDS(on)  
.
„ Outstanding thermal transfer characteristics: significantly bet-  
ter than SO-8  
Applications  
„ Battery management  
„ Ultra-low Qg x rDS(on) figure-of-merit  
„ High power and current handling capability  
„ RoHS Compliant  
„ Load Switch  
„ Battery protection  
S
G
Q1  
D
Q2  
G
S
Top  
Bottom  
MOSFET Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
-20  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current -Continuous  
-Pulsed  
V
V
±12  
(Note 1a)  
(Note 1a)  
-6.5  
ID  
A
-20  
PD  
Power Dissipation (Steady State)  
2.1  
W
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
RθJA  
RθJB  
Thermal Resistance, Junction to Case  
(Note 1)  
(Note 1a)  
(Note 1b)  
(Note 1)  
0.6  
60  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Ball  
°C/W  
108  
6.3  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
7’’  
Tape Width  
12 mm  
Quantity  
2554P  
FDZ2554P  
BGA 2.5X4.0  
3000 units  
1
©2007 Fairchild Semiconductor Corporation  
FDZ2554P Rev B  
www.fairchildsemi.com  
123456

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