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FDPF12N35 PDF预览

FDPF12N35

更新时间: 2024-11-24 03:36:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
10页 479K
描述
350V N-Channel MOSFET

FDPF12N35 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-220AB包装说明:FLANGE MOUNT, R-PSFM-T3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.35
其他特性:AVALANCHE RATED雪崩能效等级(Eas):335 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:350 V最大漏极电流 (Abs) (ID):7.5 A
最大漏极电流 (ID):12 A最大漏源导通电阻:0.38 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT APPLICABLE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):50 W
最大脉冲漏极电流 (IDM):48 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDPF12N35 数据手册

 浏览型号FDPF12N35的Datasheet PDF文件第2页浏览型号FDPF12N35的Datasheet PDF文件第3页浏览型号FDPF12N35的Datasheet PDF文件第4页浏览型号FDPF12N35的Datasheet PDF文件第5页浏览型号FDPF12N35的Datasheet PDF文件第6页浏览型号FDPF12N35的Datasheet PDF文件第7页 
April 2007  
TM  
UniFET  
FDP12N35 / FDPF12N35  
350V N-Channel MOSFET  
Features  
Description  
12A, 350V, RDS(on) = 0.38Ω @VGS = 10 V  
Low gate charge ( typical 18 nC)  
Low Crss ( typical 15 pF)  
Fast switching  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power supplies and active power factor  
correction.  
Improved dv/dt capability  
D
G
TO-220F  
FDPF Series  
TO-220  
FDP Series  
G D  
S
G
D S  
S
Absolute Maximum Ratings  
Symbol  
Parameter  
FDP12N35 FDPF12N35  
Unit  
VDSS  
Drain-Source Voltage  
Drain Current  
350  
V
ID  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
12  
7.2  
12*  
7.2*  
A
A
(Note 1)  
IDM  
Drain Current  
- Pulsed  
A
48  
48*  
VGSS  
EAS  
IAR  
Gate-Source voltage  
± 30  
335  
12  
V
mJ  
A
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
13.5  
4.5  
mJ  
V/ns  
Power Dissipation  
(TC = 25°C)  
- Derate above 25°C  
135  
1.09  
31.3  
0.25  
W
W/°C  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
300  
°C  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
°C  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
FDP12N35 FDPF12N35  
Unit  
°C/W  
°C/W  
°C/W  
RθJC  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink Typ.  
Thermal Resistance, Junction-to-Ambient  
0.92  
0.5  
4.0  
--  
RθCS  
RθJA  
62.5  
62.5  
©2007 Fairchild Semiconductor Corporation  
FDP12N35 / FDPF12N35 Rev. B  
1
www.fairchildsemi.com  

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