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FDPF12N50F PDF预览

FDPF12N50F

更新时间: 2024-11-24 12:59:39
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
10页 382K
描述
Power Field-Effect Transistor, 11.5A I(D), 500V, 0.7ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, ROHS COMPLIANT, TO-220F, 3 PIN

FDPF12N50F 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:TO-220AB包装说明:FLANGE MOUNT, R-PSFM-T3
针数:3Reach Compliance Code:compliant
风险等级:5.81Is Samacsys:N
雪崩能效等级(Eas):456 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):11.5 A最大漏极电流 (ID):11.5 A
最大漏源导通电阻:0.7 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):42 W
最大脉冲漏极电流 (IDM):46 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDPF12N50F 数据手册

 浏览型号FDPF12N50F的Datasheet PDF文件第2页浏览型号FDPF12N50F的Datasheet PDF文件第3页浏览型号FDPF12N50F的Datasheet PDF文件第4页浏览型号FDPF12N50F的Datasheet PDF文件第5页浏览型号FDPF12N50F的Datasheet PDF文件第6页浏览型号FDPF12N50F的Datasheet PDF文件第7页 
June 2007  
TM  
UniFET  
FDP12N50 / FDPF12N50  
tm  
N-Channel MOSFET  
500V, 11.5A, 0.65Ω  
Features  
Description  
RDS(on) = 0.55Ω (Typ.)@ VGS = 10V, ID = 6A  
Low gate charge ( Typ. 22nC)  
Low Crss ( Typ. 11pF)  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power supplies and active power factor  
correction.  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
RoHS compliant  
D
G
TO-220F  
TO-220  
FDP Series  
G D S  
G
D S  
FDPF Series  
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*  
Symbol  
VDSS  
VGSS  
Parameter  
FDP12N50  
FDPF12N50  
500  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
V
V
±30  
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- P uls ed  
11.5  
6.9  
46  
11.5 *  
6.9 *  
46 *  
ID  
D r a in C u r r e n t  
A
IDM  
D rai n Cur rent  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
A
mJ  
A
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalanche Current  
456  
11.5  
16.7  
4.5  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
W
W/oC  
oC  
(TC = 25oC)  
- Derate above 25oC  
165  
42  
PD  
Power Dissipation  
1.33  
0.3  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
FDP12N50 FDPF12N50  
Units  
RθJC  
RθCS  
RθJA  
0.75  
0.5  
3.0  
-
Thermal Resistance, Case to Sink Typ.  
Thermal Resistance, Junction to Ambient  
oC/W  
62.5  
62.5  
©2007 Fairchild Semiconductor Corporation  
FDP12N50 / FDPF12N50 Rev. A  
1
www.fairchildsemi.com  

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