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FDD24AN06LA0 PDF预览

FDD24AN06LA0

更新时间: 2024-11-17 22:20:51
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
11页 220K
描述
N CHANNEL LOGIC LEVEL POWER TRENCH MOSFET

FDD24AN06LA0 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-252AA包装说明:TO-252AA, 3 PIN
针数:4Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.2
雪崩能效等级(Eas):32 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):7.1 A最大漏极电流 (ID):7.1 A
最大漏源导通电阻:0.019 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):75 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDD24AN06LA0 数据手册

 浏览型号FDD24AN06LA0的Datasheet PDF文件第2页浏览型号FDD24AN06LA0的Datasheet PDF文件第3页浏览型号FDD24AN06LA0的Datasheet PDF文件第4页浏览型号FDD24AN06LA0的Datasheet PDF文件第5页浏览型号FDD24AN06LA0的Datasheet PDF文件第6页浏览型号FDD24AN06LA0的Datasheet PDF文件第7页 
February 2004  
FDD24AN06LA0  
N-Channel Logic Level PowerTrench MOSFET  
®
60V, 36A, 24mΩ  
Features  
Applications  
rDS(ON) = 20m(Typ.), VGS = 5V, ID = 36A  
Qg(tot) = 16nC (Typ.), VGS = 5V  
Low Miller Charge  
Motor / Body Load Control  
ABS Systems  
Powertrain Management  
Injection Systems  
Low QRR Body Diode  
UIS Capability (Single Pulse and Repetitive Pulse)  
Qualified to AEC Q101  
DC-DC converters and Off-line UPS  
Distributed Power Architectures and VRMs  
Primary Switch for 12V and 24V systems  
Formerly developmental type 83547  
DRAIN (FLANGE)  
D
GATE  
SOURCE  
G
TO-252AA  
FDD SERIES  
S
MOSFET Maximum Ratings TC = 25°C unless otherwise noted  
Symbol  
VDSS  
VGS  
Parameter  
Ratings  
60  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current  
V
V
±20  
Continuous (TC = 25oC, VGS = 10V)  
Continuous (TC = 25oC, VGS = 5V)  
Continuous (TC = 100oC, VGS = 5V)  
Continuous (TA = 25oC, VGS = 5V, RθJA = 52oC/W)  
Pulsed  
40  
A
36  
25  
A
A
ID  
7.1  
A
Figure 4  
32  
A
EAS  
Single Pulse Avalanche Energy (Note 1)  
mJ  
Power dissipation  
Derate above 25oC  
75  
W
PD  
0.5  
W/oC  
oC  
TJ, TSTG  
Operating and Storage Temperature  
-55 to 175  
Thermal Characteristics  
RθJC  
RθJA  
RθJA  
Thermal Resistance Junction to Case TO-252  
2.0  
100  
52  
oC/W  
oC/W  
oC/W  
Thermal Resistance Junction to Ambient TO-252  
Thermal Resistance Junction to Ambient TO-252, 1in2 copper pad area  
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a  
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/  
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.  
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems  
certification.  
©2004 Fairchild Semiconductor Corporation  
FDD24AN06LA0 Rev. A1  

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