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FD100N06A5B PDF预览

FD100N06A5B

更新时间: 2024-11-21 20:40:23
品牌 Logo 应用领域
威世 - VISHAY 二极管
页数 文件大小 规格书
3页 104K
描述
Rectifier Diode, 1 Phase, 1 Element, 600V V(RRM), Silicon, 5 INCH, WAFER

FD100N06A5B 技术参数

是否Rohs认证: 不符合生命周期:Active
零件包装代码:WAFER包装说明:5 INCH, WAFER
针数:1Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.40
风险等级:5.8应用:GENERAL PURPOSE
外壳连接:CATHODE配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
最大正向电压 (VF):0.94 VJESD-30 代码:S-XUUC-N1
元件数量:1相数:1
端子数量:1封装主体材料:UNSPECIFIED
封装形状:SQUARE封装形式:UNCASED CHIP
认证状态:Not Qualified最大重复峰值反向电压:600 V
子类别:Rectifier Diodes表面贴装:YES
端子形式:NO LEAD端子位置:UPPER
Base Number Matches:1

FD100N06A5B 数据手册

 浏览型号FD100N06A5B的Datasheet PDF文件第2页浏览型号FD100N06A5B的Datasheet PDF文件第3页 
Bulletin I0164J 09/04  
FD100N06A5B  
FRED Die in Wafer Form  
z 100% Tested at Probe (*)  
600V  
VF = 1.1 V  
(max.)  
5" Wafer  
Electrical Characteristics @ T = 25°C (unless otherwise specified)  
J
Parameter  
VFM  
VFM  
VRRM  
IRM  
Description  
Maximum Forward Voltage  
Maximum Forward Voltage  
Min  
–––  
–––  
Typ  
0.96V  
0.86V  
–––  
Max  
Test Conditions  
1.1V TJ = 25°C, IF = 8A  
(**)  
(**)  
0.94V TJ = 25°C, IF = 2A  
––– TJ = 25°C, IRRM = 100µA  
5µA TJ = 25°C, VRRM = 600V  
Minimum Reverse Breakdown Voltage 600V  
Max. Reverse Leakage Current  
–––  
–––  
Mechanical Data  
Nominal Back Metal Composition, Thickness:  
Nominal Front Metal Composition, Thickness:  
Dimensions:  
Cr-Ni-Ag ( 1kA-2kA-3kA)  
99%Al, 1%Si (3 µm)  
0.100" x 0.100" (see drawing)  
125 mm  
Wafer Diameter:  
Wafer Thickness:  
Scribe Line Width  
14mils  
90 ±10 µm  
Reject Ink Dot Size  
Recommended Storage Environment:  
0.25 mm Diameter Minimum  
Store in original container, in dessicated  
nitrogen, with no contamination  
For optimum electrical results, die attach  
temperature should not exceed 300 °C  
Recommended Die Attach Conditions:  
Die Outline  
NOTES:  
40 (1.57)  
Wafer flat alligned with  
side b of the die  
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS).  
2. CONTROLLING DIMENSION (INCH):  
a
c
0.35 ± 0.01  
(14 ± 0.4)  
3. DIMENSIONS AND TOLERANCES:  
a = 2.54 +0, - 0.01  
(100 +0, - 0.4)  
b = 2.54 +0, - 0.01  
(100 +0, - 0.4)  
C
c = 1.48 +0, - 0.01  
(58.1 +0, - 0.4)  
A
d = 1.48 +0, - 0.01  
(58.1 +0, - 0.4)  
4. LETTER DESIGNATION:  
A = Anode (Top Metal)  
C = Cathode (Back Metal)  
5. SAWING:  
Ø
125 (4.92)  
Recommended Blade  
SEMITEC S1025 QS00 Blade  
Note:  
(*) The above data sheet is based on IR sample testing under certain predetermined and assumed conditions, and is  
provided for illustration purposes only. Customers are encouraged to perform testing in actual proposed packaged  
and use conditions. IR die products are tested using IR-based quality assurance procedures and are manufactured  
using IR’s established processes. Programs for customer-specified testing are available upon request. IR has  
experienced assembly yields of generally 95% or greater for individual die; however, customer’s results may vary.  
Estimates such as those described and set forth in this data sheet for semiconductor die will vary depending on a  
number of packaging, handling, use and other factors. Sold die may not perform on an equivalent basis to standard  
package products and are therefore offered with a limited warranty as described in IR’s applicable standard terms  
and conditions of sale. All IR die sales are subject to IR’s applicable standard terms and conditions of sale, which  
are available upon request.  
(**) V limits refer to packed devices in TO-220  
F
Document Number: 93878  
www.vishay.com  
1

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