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FCP190N60_13 PDF预览

FCP190N60_13

更新时间: 2024-11-23 12:46:19
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飞兆/仙童 - FAIRCHILD /
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10页 342K
描述
N-Channel SuperFET II MOSFET

FCP190N60_13 数据手册

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March 2013  
FCP190N60 / FCPF190N60  
®
N-Channel SuperFET II MOSFET  
600 V, 20.2 A, 199 mΩ  
Features  
Description  
®
®
650 V @TJ = 150°C  
SuperFET II MOSFET is Fairchild Semiconductor ’s first gen-  
eration of high voltage super-junction (SJ) MOSFET family that is  
utilizing charge balance technology for outstanding low on-resis-  
tance and lower gate charge performance.This advanced tech-  
nology is tailored to minimize conduction loss, provide superior  
switching performance, and withstand extreme dv/dt rate and  
higher avalanche energy. Consequently, SuperFETII MOSFET is  
suitable for various AC/DC power conversion for system minia-  
turization and higher efficiency.  
Max. RDS(on) = 199 mΩ  
Ultra low gate charge (Typ. Qg = 57 nC)  
Low effective output capacitance (Typ. Coss.eff = 160 pF)  
100% avalanche tested  
Applications  
LCD / LED / PDP TV Lighting  
Solar Inverter  
AC-CD Power Supply  
D
G
TO-220  
TO-220F  
G D  
S
G D S  
S
Absolute Maximum Ratings TC = 25oC unless otherwise noted  
Symbol  
VDSS  
Parameter  
FCP190N60 FCPF190N60  
Unit  
Drain to Source Voltage  
Gate to Source Voltage  
600  
±20  
±30  
V
-DC  
VGSS  
ID  
V
A
-AC  
(f > 1 Hz)  
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- Pulsed  
20.2  
12.7  
60.6  
20.2*  
12.7*  
60.6*  
Drain Current  
IDM  
EAS  
IAR  
Drain Current  
(Note 1)  
A
mJ  
Single Pulsed Avalanche Energy  
Avalanche Current  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
400  
4.0  
2.1  
20  
A
EAR  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
MOSFET dv/dt  
mJ  
V/ns  
V/ns  
W
W/oC  
oC  
dv/dt  
PD  
100  
(TC = 25oC)  
- Derate above 25oC  
208  
39  
Power Dissipation  
1.67  
0.31  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Unit  
FCP190N60 FCPF190N60  
RθJC  
RθCS  
RθJA  
Thermal Resistance, Junction to Case  
0.6  
0.5  
3.2  
0.5  
Thermal Resistance, Case to Heat Sink (Typical)  
Thermal Resistance, Junction to Ambient  
oC/W  
62.5  
62.5  
©2012 Fairchild Semiconductor Corporation  
FCP190N60 / FCPF190N60 Rev. C15  
1
www.fairchildsemi.com  

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