是否无铅: | 不含铅 | 生命周期: | Active |
包装说明: | VFBGA, | Reach Compliance Code: | compliant |
Factory Lead Time: | 28 weeks 6 days | 风险等级: | 5.7 |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码: | R-PBGA-B42 | JESD-609代码: | e1 |
长度: | 3.06 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 42 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 座面最大高度: | 0.65 mm |
最大供电电压 (Vsup): | 6.4 V | 最小供电电压 (Vsup): | 2.66 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.4 mm |
端子位置: | BOTTOM | 宽度: | 2.78 mm |
Base Number Matches: | 1 |
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