是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | CSP |
包装说明: | 1.26 X 0.86 MM, WLCSP-6 | 针数: | 6 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.66 | 商用集成电路类型: | CONSUMER CIRCUIT |
JESD-30 代码: | R-PBGA-B6 | JESD-609代码: | e1 |
长度: | 1.26 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 6 |
最高工作温度: | 85 °C | 最低工作温度: | -30 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA6,2X3,20 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 1.8 V | 认证状态: | Not Qualified |
座面最大高度: | 0.3 mm | 子类别: | Audio/Video Amplifiers |
最大供电电压 (Vsup): | 3.63 V | 最小供电电压 (Vsup): | 1.64 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.485 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 0.86 mm | Base Number Matches: | 1 |
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