是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | WLCSP-16 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.63 |
商用集成电路类型: | CONSUMER CIRCUIT | JESD-30 代码: | R-PBGA-B6 |
JESD-609代码: | e1 | 长度: | 1.26 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 6 | 最高工作温度: | 85 °C |
最低工作温度: | -30 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装等效代码: | BGA6,2X3,22/19 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 1.8 V |
认证状态: | Not Qualified | 座面最大高度: | 0.3 mm |
子类别: | Audio/Video Amplifiers | 最大供电电压 (Vsup): | 3.63 V |
最小供电电压 (Vsup): | 1.64 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.485 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 0.86 mm |
Base Number Matches: | 1 |
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