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ERJ3GEYJ110X PDF预览

ERJ3GEYJ110X

更新时间: 2024-09-14 03:22:15
品牌 Logo 应用领域
松下 - PANASONIC /
页数 文件大小 规格书
4页 309K
描述
Fixed Resistor, Metal Glaze/thick Film, 0.1W, 11ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0603, CHIP

ERJ3GEYJ110X 数据手册

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Thick Film Chip Resistors  
Thick Film Chip Resistors  
0201, 0402, 0603, 0805, 1206,  
1210, 1812, 2010, 2512  
Type: ERJ 1G, 2G, 3G, 6G, 8G, 14,  
12, 12Z, 1T  
n Features  
l Small size and lightweight  
l High reliability  
Metal glaze thick film resistive element and three layers of electrodes  
l Compatible with placement machines  
Taping and bulk case packaging available  
l Suitable for both reflow and flow soldering  
l Approved under the ISO 9001 system  
Approved under the QS-9000 system  
l Reference Standards  
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A  
n Explanation of Part Numbers  
Packaging Specifications  
Packaging  
Code  
Punched (Paper) Taping  
(Only 3G, 6G, 8G type)  
V
Embossed Taping  
(Only 14, 12, 12Z, 1T type)  
U
B
Bulk case  
(Only 2G, 3G, 6G type)  
Punched (Paper) Taping  
2 mm pitch, 10000 pcs.  
(Only 2G, 3G type)  
X
Y
C
Punched (Paper) Taping  
2 mm pitch, 20000 pcs.  
(Only 2G type)  
Punched (Paper) Taping  
2 mm pitch, 15000 pcs.  
(Only 1G type)  
] When partly omitted, all the rest P/N factors should be moved up respectively.  
Rev.02/04  
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.  
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.  

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