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EP3C5

更新时间: 2024-09-12 06:50:39
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阿尔特拉 - ALTERA /
页数 文件大小 规格书
7页 158K
描述
Cyclone Series Device Thermal Resistance

EP3C5 数据手册

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Cyclone Series Device  
Thermal Resistance  
May 2008, version 3.0  
Data Sheet  
The following table shows the revision history for this data sheet.  
Revision  
History  
Date  
Document Version  
Changes Made  
May 2008  
July 2007  
May 2007  
3.0  
2.2  
2.1  
Updated Tables 2, 4, and 5.  
Updated values for EP3C25 (E144) device in Table 2.  
Updated values for EP3C10 (E144) device in Table 2 and added  
Revision History.  
March 2007  
April 2006  
2.0  
1.0  
Added Cyclone III information.  
Initial release.  
Tables 1 through 6 in this data sheet provide θJA (junction-to-ambient  
thermal resistance) and θJC (junction-to-case thermal resistance) values  
for Altera® Cyclone® series devices available in Ball-Grid Array (BGA),  
FineLine® BGA (FBGA), Micro FineLine BGA® (MBGA), Ultra FineLine  
BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC),  
Plastic Enhanced Quad Flat Pack (EQFP), Thin Quad Flat Pack (TQFP),  
Plastic Quad Flat Pack (PQFP), and Power Quad Flat Pack (RQFP).  
f
For additional packaging information, refer to the Altera Device Packaging  
Data Sheet.  
Altera Corporation  
1
DS-CYTHRML-3.0  

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