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EP20K1000CF672C-8 PDF预览

EP20K1000CF672C-8

更新时间: 2024-02-04 04:41:45
品牌 Logo 应用领域
英特尔 - INTEL LTE输入元件可编程逻辑
页数 文件大小 规格书
94页 780K
描述
LOADABLE PLD, 1.79ns, PBGA672, 27 X 27 MM, 1 MM PITCH, FBGA-672

EP20K1000CF672C-8 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:BGA
包装说明:27 X 27 MM, 1 MM PITCH, FBGA-672针数:672
Reach Compliance Code:compliant风险等级:5.12
JESD-30 代码:S-PBGA-B672JESD-609代码:e0
长度:27 mm专用输入次数:4
I/O 线路数量:508端子数量:672
最高工作温度:85 °C最低工作温度:
组织:4 DEDICATED INPUTS, 508 I/O输出函数:MACROCELL
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):220可编程逻辑类型:LOADABLE PLD
传播延迟:1.79 ns认证状态:Not Qualified
座面最大高度:3.5 mm最大供电电压:1.89 V
最小供电电压:1.71 V标称供电电压:1.8 V
表面贴装:YES温度等级:OTHER
端子面层:TIN LEAD端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:27 mm
Base Number Matches:1

EP20K1000CF672C-8 数据手册

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APEX 20KC Programmable Logic Device Data Sheet  
Table 4. APEX 20KC FineLine BGA Package Options & I/O Count Notes (1), (2)  
Device  
484 Pin  
672 Pin  
1,020 Pin  
EP20K200C  
EP20K400C  
EP20K600C  
EP20K1000C  
376  
488 (3)  
508 (3)  
508 (3)  
588  
708  
Notes to Tables 3 and 4:  
(1) I/O counts include dedicated input and clock pins.  
(2) APEX 20KC device package types include plastic quad flat pack (PQFP), 1.27-mm  
pitch ball-grid array (BGA), and 1.00-mm pitch FineLine BGATM packages.  
(3) This device uses a thermally enhanced package, which is taller than the regular  
package. Consult the Altera Device Package Information Data Sheet for detailed  
package size information.  
Table 5. APEX 20KC QFP & BGA Package Sizes  
Feature  
208-Pin PQFP  
240-Pin PQFP  
356-Pin BGA  
652-Pin BGA  
Pitch (mm)  
Area (mm2)  
0.50  
924  
0.50  
1,218  
1.27  
1,225  
1.27  
2,025  
Length × Width (mm × mm)  
30.4 × 30.4  
34.9 × 34.9  
35.0 × 35.0  
45.0 × 45.0  
Table 6. APEX 20KC FineLine BGA Package Sizes  
Feature  
484 Pin  
672 Pin  
1,020 Pin  
Pitch (mm)  
Area (mm2)  
1.00  
529  
1.00  
729  
1.00  
1,089  
Length × Width (mm × mm)  
23 × 23  
27 × 27  
33 × 33  
Similar to APEX 20K and APEX 20KE devices, APEX 20KC devices offer  
the MultiCore architecture, which combines the strengths of LUT-based  
and product-term-based devices with an enhanced memory structure.  
LUT-based logic provides optimized performance and efficiency for data-  
path, register-intensive, mathematical, or digital signal processing (DSP)  
designs. Product-term-based logic is optimized for complex  
General  
Description  
combinatorial paths, such as complex state machines. LUT- and product-  
term-based logic combined with memory functions and a wide variety of  
MegaCore and AMPP functions make the APEX 20KC architecture  
uniquely suited for SOPC designs. Applications historically requiring a  
combination of LUT-, product-term-, and memory-based devices can now  
be integrated into one APEX 20KC device.  
4
Altera Corporation  

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