Datasheet > EDI88512CA17MIG

EDI88512CA17MIG

更新时间： 2024-11-03 15:31:31

品牌	Logo	应用领域
WEDC		静态存储器光电二极管
页数	文件大小	规格书
9页	310K
描述
Standard SRAM, 512KX8, 17ns, CMOS, PDSO36, ROHS COMPLIANT, PLASTIC, SOJ-36

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

EDI88512CA17MIG 数据手册

EDI88512CA-XMXG

WPS512K8X-XRJXG

White Electronic Designs

512Kx8 Plastic Monolithic SRAM CMOS

WEDC's ruggedized plastic 512Kx8 SRAM that allows

the user to capitalize on the cost advantage of using a

plastic component while not sacriﬁcing all of the reliability

available in a full military device.

FEATURES

■

512Kx8 bit CMOS Static

■

Random Access Memory

Extended temperature testing is performed with the test

patterns developed for use on WEDC’s fully compliant

512Kx8 SRAMs. WEDC fully characterizes devices

to determine the proper test patterns for testing at

temperature extremes. This is critical because the

operating characteristics of device change when it is

operated beyond the commercial guarantee a device that

operates reliably in the ﬁeld at temperature extremes.

Users of WEDC’s ruggedized plastic beneﬁt from WEDC’s

extensive experience in characterizing SRAMs for use in

military systems.

• Access Times of 17, 20, 25ns

• Data Retention Function (LPA version)

• Extended Temperature Testing

• Data Retention Functionality Testing

36 lead JEDEC Approved Revolutionary Pinout

• Plastic SOJ (Package 319)

■

Single +5V (±10%) Supply Operation

RoHS compliant

WEDC ensures Low Power devices will retain data in Data

Retention mode by characterizing the devices to determine

the appropriate test conditions. This is crucial for systems

operating at -40°C or below and using dense memories

such as 512Kx8s.

WEDC’s ruggedized plastic SOJ is footprint compatible

with WEDC’s full military ceramic 36 pin SOJ.

FIG. 1 – PIN CONFIGURATION

PIN Description

TOP VIEW

I/O0-7

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

A^0-18

WE#

CS#

OE#

V^CC

36 NC

35 A18

34 A17

33 A16

32 A15

31 OE#

30 I/O7

29 I/O6

28 VSS

27 VCC

26 I/O5

25 I/O4

24 A14

23 A13

22 A12

21 A11

20 A10

19 NC

CS#

I/O0

I/O1

VCC

Output Enable

Power (+5V ±10%)

Ground

BLOCK DIAGRAM

36pin

V^SS

VSS 10

I/O2 11

I/O3 12

WE# 13

A5 14

Revolutionary

Not Connected

Memory Array

A6 15

A7 16

A8 17

Address

Buffer

Address

Decoder

I/O

Ø-18

I/OØ-7

Circuits

A9 18

WE#

CS#

OE#

February 2009

Rev. 8

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

12 3 4 5 6 7...9

中文翻译

下载PDF

与EDI88512CA17MIG相关器件

型号	品牌	获取价格	描述	数据表
EDI88512CA17MIRP	WEDC	获取价格	Standard SRAM, 512KX8, 17ns, CMOS, PDSO36,
EDI88512CA17MM	WEDC	获取价格	Standard SRAM, 512KX8, 17ns, CMOS, PDSO36, PLASTIC, SOJ-36
EDI88512CA17MMG	MICROSEMI	获取价格	512KX8 STANDARD SRAM, 17ns, PDSO36, ROHS COMPLIANT, PLASTIC, SOJ-36
EDI88512CA-17MMG	MERCURY	获取价格	Standard SRAM, 512KX8, 17ns, CMOS, PDSO36, ROHS COMPLIANT, PLASTIC, SOJ-36
EDI88512CA17MMRP	WEDC	获取价格	Standard SRAM, 512KX8, 17ns, CMOS, PDSO36,
EDI88512CA17N36B	MERCURY	获取价格	Standard SRAM, 512KX8, 17ns, CMOS, CDSO36, CERAMIC, SOJ-36
EDI88512CA17N36C	ETC	获取价格	x8 SRAM
EDI88512CA17N36I	ETC	获取价格	x8 SRAM
EDI88512CA17N36M	MICROSEMI	获取价格	Standard SRAM, 512KX8, 17ns, CMOS, CDSO36, CERAMIC, SOJ-36
EDI88512CA17NB	ETC	获取价格	x8 SRAM

与EDI88512CA17MIG相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

9
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

4
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

26
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

25

产品中心

服务支持

精选活动

关于我们

帮助中心

EDI88512CA17MIG

EDI88512CA17MIG 数据手册

与EDI88512CA17MIG相关器件

与EDI88512CA17MIG相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

EDI88512CA17MIG

EDI88512CA17MIG 数据手册

与EDI88512CA17MIG相关器件

与EDI88512CA17MIG相关文章

您还可以找

您在本页遇到什么问题？