EDI7F341MC
1 MEG x 32 FLASH MODULE
FIG. 1
DESCRIPTION
BLOCK DIAGRAMS
The EDI7F341MC and EDI7F2341MC are organized as one and
two banks of 1 Meg x 32 respectively. The modules are based on
Intel's E28F008SA - 1Meg x 8 Flash device in TSOP packages
which are mounted on an FR4 substrate.
EDI7F341MC-BNC: 1 MEG x 32 80 PIN SIMM
E0\
A0-A19
Both modules offer access times between 90 and 150ns allowing
for operation of high-speed microprocessors without wait states.
G\
DQ0-DQ7
1Mx8
W0\
DQ8-DQ15
DQ16-DQ23
DQ24-DQ31
1Mx8
1Mx8
1Mx8
FEATURES
W1\
W2\
1 Meg x 32 and 2 x 1 Meg x 32 Densities
Based on Intel's E28F008SA Flash Device
Fast Read Access Time - 90ns
5- Volt-Only Reprogramming or 12V Reprogram.
Low Power Dissipation
60mA per Device Active Current
10µA per Device CMOS Standby Current
Typical Endurance >100,000 Cycles
Single 5 Volt +10% Supply
W3\
EDI7F2341MC-BNC: 2 x 1 MEG x 32 80 PIN SIMM
E1\
CMOS and TTL Compatible Inputs and Outputs
Commercial and Industrial Temperature Range
Package
E0\
A0-A19
G\
1Mx8
80 Pin SIMM (JEDEC)
1Mx8
1Mx8
1Mx8
1Mx8
DQ0-DQ7
W0\
1Mx8
1Mx8
1Mx8
DQ8-DQ15
DQ16-DQ23
DQ24-DQ31
W1\
W2\
W3\
White Electronic Designs Corporation (508) 366-5151 www.whiteedc.com
May 2001 Rev. 2
ECO #14186
1