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DTC123JUA-TP-HF PDF预览

DTC123JUA-TP-HF

更新时间: 2024-11-12 13:07:27
品牌 Logo 应用领域
美微科 - MCC 晶体数字晶体管
页数 文件大小 规格书
3页 219K
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DTC123JUA-TP-HF 数据手册

 浏览型号DTC123JUA-TP-HF的Datasheet PDF文件第2页浏览型号DTC123JUA-TP-HF的Datasheet PDF文件第3页 
M C C  
TM  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
Micro Commercial Components  
DTC123JCA  
Features  
Epitaxial Planar Die Construction  
Complementary NPN Types Available  
Built-In Biasing Resistors  
·
·
·
·
Digital Transistors  
Lead Free Finish/RoHS Compliant ("P" Suffix designates  
RoHS Compliant. See ordering information)  
Epoxy meets UL 94 V-0 flammability rating  
Moisure Sensitivity Level 1  
·
·
SOT-23  
A
Absolute maximum ratings @ 25  
к
D
Symbol  
VCC  
VIN  
Parameter  
Min  
---  
Typ  
50  
Max  
---  
Unit  
V
3
Supply voltage  
Input voltage  
-5  
---  
---  
+12  
---  
V
mW  
B
C
Pd  
Power dissipation  
Junction temperature  
200  
150  
1:IN  
Tj  
---  
---  
ć
ć
2
1
2:GND  
3:OUT  
Tstg  
IO  
Storage temperature  
-55  
---  
150  
F
E
100  
100  
Output current  
mA  
IC(MAX)  
Electrical Characteristics @ 25  
к
H
G
J
Symbol  
VI(off)  
VI(on)  
VO(on)  
II  
Parameter  
Min  
---  
Typ  
---  
Max  
0.5  
---  
Unit  
V
Input voltage (VCC=5V, IO=100 A)  
­
K
1.1  
---  
---  
V
(VO=0.3V, IO=5mA)  
Output voltage (IO=5mA,Ii=0.25mA)  
Input current (VI=5V)  
DIMENSIONS  
0.1  
---  
0.3  
3.6  
0.5  
---  
V
mA  
---  
INCHES  
MM  
IO(off)  
GI  
Output current (VCC=50V, VI=0)  
DC current gain (VO=5V, IO=10mA)  
Input resistance  
---  
---  
A
DIM  
A
B
C
D
E
MIN  
.110  
.083  
.047  
.035  
.070  
.018  
.0005  
.035  
.003  
.015  
MAX  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
.89  
MAX  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
NOTE  
­
.120  
.098  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
80  
---  
R1  
1.54  
17  
2.2  
21  
2.86  
26  
K
¡
R2/R1  
Resistance ratio  
Transition frequency  
(VCE=10V, IE=5mA, f=100MHz)  
fT  
---  
250  
---  
MHz  
F
G
H
J
.100  
1.12  
.180  
.51  
.085  
.37  
K
Suggested Solder  
Pad Layout  
*Marking: E42  
.031  
.800  
.035  
.900  
.079  
2.000  
inches  
mm  
.037  
.950  
.037  
.950  
www.mccsemi.com  
1 of 3  
Revision: A  
2011/01/01  

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